Development of electromagnetic analytical models for substrate noise propagation in integrated circuits

M. Grau Novellas; R. Serra; Matthias Rose

doi:10.1109/ISEMC.2015.7256228

Development of electromagnetic analytical models for substrate noise propagation in integrated circuits

M. Grau Novellas, R. Serra, Matthias Rose

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

1 Citation (Scopus)

2 Downloads (Pure)

Abstract

In this paper, electromagnetic analytical models for substrate noise propagation are developed for its use in electromagnetic compatibility performance prediction for integrated circuits. The propagation mechanisms for surface waves caused by injected currents are studied and models covering different substrate technology options are provided. In addition, closed-form expressions for interference prediction are derived in order to provide useful information regarding substrate noise coupling at early stages of the design process.

Original language	English
Title of host publication	proceedings of the 2015 IEEE international symposium on electromagnetic compatibility (EMC)
Publisher	Institute of Electrical and Electronics Engineers
Pages	582 - 587
DOIs	https://doi.org/10.1109/ISEMC.2015.7256228
Publication status	Published - 2015
Event	IEEE International Symposium on Electromagnetic Compatibility, EMC 2015 - Dresden, Germany Duration: 16 Aug 2015 → 22 Aug 2015 http://conference.vde.com/emc2015/Pages/default.aspx

Conference

Conference	IEEE International Symposium on Electromagnetic Compatibility, EMC 2015
Abbreviated title	EMC 2015
Country/Territory	Germany
City	Dresden
Period	16/08/15 → 22/08/15
Internet address	http://conference.vde.com/emc2015/Pages/default.aspx

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10.1109/ISEMC.2015.7256228

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title = "Development of electromagnetic analytical models for substrate noise propagation in integrated circuits",

abstract = "In this paper, electromagnetic analytical models for substrate noise propagation are developed for its use in electromagnetic compatibility performance prediction for integrated circuits. The propagation mechanisms for surface waves caused by injected currents are studied and models covering different substrate technology options are provided. In addition, closed-form expressions for interference prediction are derived in order to provide useful information regarding substrate noise coupling at early stages of the design process.",

author = "{Grau Novellas}, M. and R. Serra and Matthias Rose",

year = "2015",

doi = "10.1109/ISEMC.2015.7256228",

language = "English",

pages = "582 -- 587",

booktitle = "proceedings of the 2015 IEEE international symposium on electromagnetic compatibility (EMC)",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "IEEE International Symposium on Electromagnetic Compatibility, EMC 2015, EMC 2015 ; Conference date: 16-08-2015 Through 22-08-2015",

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}

Grau Novellas, M, Serra, R & Rose, M 2015, Development of electromagnetic analytical models for substrate noise propagation in integrated circuits. in proceedings of the 2015 IEEE international symposium on electromagnetic compatibility (EMC). Institute of Electrical and Electronics Engineers, pp. 582 - 587, IEEE International Symposium on Electromagnetic Compatibility, EMC 2015, Dresden, Germany, 16/08/15. https://doi.org/10.1109/ISEMC.2015.7256228

Development of electromagnetic analytical models for substrate noise propagation in integrated circuits. / Grau Novellas, M.; Serra, R.; Rose, Matthias.
proceedings of the 2015 IEEE international symposium on electromagnetic compatibility (EMC). Institute of Electrical and Electronics Engineers, 2015. p. 582 - 587.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Development of electromagnetic analytical models for substrate noise propagation in integrated circuits

AU - Grau Novellas, M.

AU - Serra, R.

AU - Rose, Matthias

PY - 2015

Y1 - 2015

N2 - In this paper, electromagnetic analytical models for substrate noise propagation are developed for its use in electromagnetic compatibility performance prediction for integrated circuits. The propagation mechanisms for surface waves caused by injected currents are studied and models covering different substrate technology options are provided. In addition, closed-form expressions for interference prediction are derived in order to provide useful information regarding substrate noise coupling at early stages of the design process.

AB - In this paper, electromagnetic analytical models for substrate noise propagation are developed for its use in electromagnetic compatibility performance prediction for integrated circuits. The propagation mechanisms for surface waves caused by injected currents are studied and models covering different substrate technology options are provided. In addition, closed-form expressions for interference prediction are derived in order to provide useful information regarding substrate noise coupling at early stages of the design process.

U2 - 10.1109/ISEMC.2015.7256228

DO - 10.1109/ISEMC.2015.7256228

M3 - Conference contribution

SP - 582

EP - 587

BT - proceedings of the 2015 IEEE international symposium on electromagnetic compatibility (EMC)

PB - Institute of Electrical and Electronics Engineers

T2 - IEEE International Symposium on Electromagnetic Compatibility, EMC 2015

Y2 - 16 August 2015 through 22 August 2015

ER -

Development of electromagnetic analytical models for substrate noise propagation in integrated circuits

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