Development of electromagnetic analytical models for substrate noise propagation in integrated circuits

M. Grau Novellas, R. Serra, Matthias Rose

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Abstract

In this paper, electromagnetic analytical models for substrate noise propagation are developed for its use in electromagnetic compatibility performance prediction for integrated circuits. The propagation mechanisms for surface waves caused by injected currents are studied and models covering different substrate technology options are provided. In addition, closed-form expressions for interference prediction are derived in order to provide useful information regarding substrate noise coupling at early stages of the design process.
Original languageEnglish
Title of host publicationproceedings of the 2015 IEEE international symposium on electromagnetic compatibility (EMC)
PublisherInstitute of Electrical and Electronics Engineers
Pages582 - 587
DOIs
Publication statusPublished - 2015
EventIEEE International Symposium on Electromagnetic Compatibility, EMC 2015 - Dresden, Germany
Duration: 16 Aug 201522 Aug 2015
http://conference.vde.com/emc2015/Pages/default.aspx

Conference

ConferenceIEEE International Symposium on Electromagnetic Compatibility, EMC 2015
Abbreviated titleEMC 2015
CountryGermany
CityDresden
Period16/08/1522/08/15
Internet address

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