Deep reactive ion etching of through silicon vias

Fred Roozeboom, Michiel A. Blauw, Yann Lamy, Eric van Grunsven, Wouter Dekkers, Jan F. Verhoeven, Eric F. van den Heuvel, Emile van der Drift, Erwin W.M.M. Kessels, Richard M.C.M. van de Sanden

Research output: Chapter in Book/Report/Conference proceedingChapterAcademicpeer-review

6 Citations (Scopus)

Abstract

This chapter contains sections titled:
• Introduction
• DRIE Equipment and Characterization
• DRIE Processing
• Practical Solutions in Via Etching
• Concluding Remarks
• Appendix A: Glossary of Abbreviations
• Appendix B: Examples of DRIE Recipes
• References
Original languageEnglish
Title of host publicationHandbook of 3D integration : technology and applications of 3D integrated circuits
EditorsP. Garrou, C. Bower, P. Ramm
Place of PublicationWeinheim
PublisherWiley-VCH Verlag
Pages45-91
Number of pages47
ISBN (Print)978-3-527-32034-9
DOIs
Publication statusPublished - 25 Nov 2008

Keywords

  • Deep reactive ion etching (DRIE)
  • Plasma
  • Via etching

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