Abstract
This chapter contains sections titled:
• Introduction
• DRIE Equipment and Characterization
• DRIE Processing
• Practical Solutions in Via Etching
• Concluding Remarks
• Appendix A: Glossary of Abbreviations
• Appendix B: Examples of DRIE Recipes
• References
• Introduction
• DRIE Equipment and Characterization
• DRIE Processing
• Practical Solutions in Via Etching
• Concluding Remarks
• Appendix A: Glossary of Abbreviations
• Appendix B: Examples of DRIE Recipes
• References
Original language | English |
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Title of host publication | Handbook of 3D integration : technology and applications of 3D integrated circuits |
Editors | P. Garrou, C. Bower, P. Ramm |
Place of Publication | Weinheim |
Publisher | Wiley-VCH Verlag |
Pages | 45-91 |
Number of pages | 47 |
ISBN (Print) | 978-3-527-32034-9 |
DOIs | |
Publication status | Published - 25 Nov 2008 |
Keywords
- Deep reactive ion etching (DRIE)
- Plasma
- Via etching