Deep reactive ion etching of through silicon vias

Fred Roozeboom; Michiel A. Blauw; Yann Lamy; Eric van Grunsven; Wouter Dekkers; Jan F. Verhoeven; Eric F. van den Heuvel; Emile van der Drift; Erwin W.M.M. Kessels; Richard M.C.M. van de Sanden

doi:10.1002/9783527623051.ch4

Deep reactive ion etching of through silicon vias

Fred Roozeboom, Michiel A. Blauw, Yann Lamy, Eric van Grunsven, Wouter Dekkers, Jan F. Verhoeven, Eric F. van den Heuvel, Emile van der Drift, Erwin W.M.M. Kessels, Richard M.C.M. van de Sanden

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Academic › peer-review

9 Citations (Scopus)

Abstract

This chapter contains sections titled:
• Introduction
• DRIE Equipment and Characterization
• DRIE Processing
• Practical Solutions in Via Etching
• Concluding Remarks
• Appendix A: Glossary of Abbreviations
• Appendix B: Examples of DRIE Recipes
• References

Original language	English
Title of host publication	Handbook of 3D integration : technology and applications of 3D integrated circuits
Editors	P. Garrou, C. Bower, P. Ramm
Place of Publication	Weinheim
Publisher	Wiley-VCH Verlag
Pages	45-91
Number of pages	47
ISBN (Print)	978-3-527-32034-9
DOIs	https://doi.org/10.1002/9783527623051.ch4
Publication status	Published - 25 Nov 2008

Keywords

Deep reactive ion etching (DRIE)
Plasma
Via etching

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10.1002/9783527623051.ch4

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Roozeboom, F., Blauw, M. A., Lamy, Y., van Grunsven, E., Dekkers, W., Verhoeven, J. F., van den Heuvel, E. F., van der Drift, E., Kessels, E. W. M. M., & van de Sanden, R. M. C. M. (2008). Deep reactive ion etching of through silicon vias. In P. Garrou, C. Bower, & P. Ramm (Eds.), Handbook of 3D integration : technology and applications of 3D integrated circuits (pp. 45-91). Wiley-VCH Verlag. https://doi.org/10.1002/9783527623051.ch4

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abstract = "This chapter contains sections titled: • Introduction• DRIE Equipment and Characterization• DRIE Processing• Practical Solutions in Via Etching• Concluding Remarks• Appendix A: Glossary of Abbreviations• Appendix B: Examples of DRIE Recipes• References",

keywords = "Deep reactive ion etching (DRIE), Plasma, Via etching",

author = "Fred Roozeboom and Blauw, {Michiel A.} and Yann Lamy and {van Grunsven}, Eric and Wouter Dekkers and Verhoeven, {Jan F.} and {van den Heuvel}, {Eric F.} and {van der Drift}, Emile and Kessels, {Erwin W.M.M.} and {van de Sanden}, {Richard M.C.M.}",

year = "2008",

month = nov,

day = "25",

doi = "10.1002/9783527623051.ch4",

language = "English",

isbn = "978-3-527-32034-9",

pages = "45--91",

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Roozeboom, F, Blauw, MA, Lamy, Y, van Grunsven, E, Dekkers, W, Verhoeven, JF, van den Heuvel, EF, van der Drift, E, Kessels, EWMM & van de Sanden, RMCM 2008, Deep reactive ion etching of through silicon vias. in P Garrou, C Bower & P Ramm (eds), Handbook of 3D integration : technology and applications of 3D integrated circuits. Wiley-VCH Verlag, Weinheim, pp. 45-91. https://doi.org/10.1002/9783527623051.ch4

Deep reactive ion etching of through silicon vias. / Roozeboom, Fred; Blauw, Michiel A.; Lamy, Yann et al.

Handbook of 3D integration : technology and applications of 3D integrated circuits. ed. / P. Garrou; C. Bower; P. Ramm. Weinheim : Wiley-VCH Verlag, 2008. p. 45-91.

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Academic › peer-review

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T1 - Deep reactive ion etching of through silicon vias

AU - Roozeboom, Fred

AU - Blauw, Michiel A.

AU - Lamy, Yann

AU - van Grunsven, Eric

AU - Dekkers, Wouter

AU - Verhoeven, Jan F.

AU - van den Heuvel, Eric F.

AU - van der Drift, Emile

AU - Kessels, Erwin W.M.M.

AU - van de Sanden, Richard M.C.M.

PY - 2008/11/25

Y1 - 2008/11/25

N2 - This chapter contains sections titled: • Introduction• DRIE Equipment and Characterization• DRIE Processing• Practical Solutions in Via Etching• Concluding Remarks• Appendix A: Glossary of Abbreviations• Appendix B: Examples of DRIE Recipes• References

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BT - Handbook of 3D integration : technology and applications of 3D integrated circuits

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A2 - Bower, C.

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PB - Wiley-VCH Verlag

CY - Weinheim

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Deep reactive ion etching of through silicon vias

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Keywords

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