Abstract
| Original language | English |
|---|---|
| Pages (from-to) | 1733-1738 |
| Journal | Microelectronics and Reliability : an International Journal and World Abstracting Service |
| Volume | 44 |
| Issue number | 9-11 |
| DOIs | |
| Publication status | Published - 2004 |
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Creep as a reliability problem in MEMS. / Modlinski, R.; Witvrouw, A.; Ratchev, P.; Jourdain, A.; Simons, V.; Tilmans, H.A.C.; Toonder, den, J.M.J.; Puers, R.; Wolf, I.C.D.Y.M.
In: Microelectronics and Reliability : an International Journal and World Abstracting Service, Vol. 44, No. 9-11, 2004, p. 1733-1738.Research output: Contribution to journal › Article › Academic › peer-review
TY - JOUR
T1 - Creep as a reliability problem in MEMS
AU - Modlinski, R.
AU - Witvrouw, A.
AU - Ratchev, P.
AU - Jourdain, A.
AU - Simons, V.
AU - Tilmans, H.A.C.
AU - Toonder, den, J.M.J.
AU - Puers, R.
AU - Wolf, I.C.D.Y.M.
PY - 2004
Y1 - 2004
N2 - 15th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AB - 15th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
U2 - 10.1016/j.microrel.2004.07.066
DO - 10.1016/j.microrel.2004.07.066
M3 - Article
VL - 44
SP - 1733
EP - 1738
JO - Microelectronics Reliability
JF - Microelectronics Reliability
SN - 0026-2714
IS - 9-11
ER -