Creating options for 3D-SIC testing

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

3 Citations (Scopus)
22 Downloads (Pure)


Three-dimensional stacked ICs hold the promise of heterogeneous integration, inter-die connections with increased performance at lower power dissipation, and increased yield and hence decreased product cost. However, all of the above can only become true if 3D-SICs can be properly tested for manufacturing defects. Companies have started to develop their test strategies for these products, and the outcome is largely dependent on (1) the necessity of test generation for specific new 3D defects, (2) the feasibility of access the test targets, and (3) the economic trade-offs involved. Test research is needed to create options for these challenges.
Original languageEnglish
Title of host publicationVLSI Design, Automation, and Test (VLSI-DAT), 2013 International Symposium
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Number of pages7
ISBN (Electronic)978-1-4673-4436-4
ISBN (Print)978-1-4673-4435-7
Publication statusPublished - Apr 2013
Externally publishedYes
Event2013 International Symposium on VLSI Design, Automation, and Test (VLSI-DAT) - The Ambassador Hotel, Hsinchu, Taiwan
Duration: 22 Apr 201324 Apr 2013
Conference number: 2013


Conference2013 International Symposium on VLSI Design, Automation, and Test (VLSI-DAT)
Abbreviated titleVLSI-DAT


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