Abstract
Abstract
This paper introduces an approach to study the coupling
structure between the design parameters and design objectives
of a LED system-in-package (SiP) design concept [1]. The
LED SiP is an integrated device that combines the LED chip
with driver chips and potential other components in a single
package, simplifying the design of lighting products and
reducing the packaging costs. Due to the miniaturized design
of the LED SiP, the interactions between the several
components of heterogeneous nature become more dominant
in the product behaviour, which complicates a proper design
of such products. To overcome these complications the nature
and intensity of the interactions between the different
components must be clarified. Therefore a study was done on
the coupling structure of these components in the LED SiP. A
parameterization scheme is introduced to relate the design
parameters to the design objectives. Two intermediate
response levels are introduced to represent the physics-based
behaviour inside the LED SiP. A Critical Parameter Sheet
(CPS) like approach is adopted to analyse the influence of the
couplings between the design parameters, the design
objectives and the introduced physics-based response levels.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 4th Electronics Systems Integration Technologies Conference (ESTC2012), September 17-20 2012, Amsterdam |
| Publication status | Published - 2012 |