Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy

E.W.C. Coenen, M.A. Matin, W.P. Vellinga, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

2 Citations (Scopus)

Abstract

Intrinsic thermal fatigue in a mechanically unconstrained Sn-rich Sn-3.8Ag-0.7Cu alloy has been investigated under cyclic thermal loading within the temperature range of 293 K to 353 K. Fatigue damage resulting from this cycling is shown to occur preferentially along some grain boundaries. From a combination of Orientation Imaging Microscopy and Finite Element Modelling it appears that fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.

Original languageEnglish
Title of host publicationProceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages497-501
Number of pages5
ISBN (Print)0-7803-9062-8, 978-0-7803-9062-1
DOIs
Publication statusPublished - 2005
Event6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2005) - Berlin, Germany
Duration: 18 Apr 200520 Apr 2005
Conference number: 6

Conference

Conference6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2005)
Abbreviated titleEuroSimE 2005
CountryGermany
CityBerlin
Period18/04/0520/04/05

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