Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy

E.W.C. Coenen; M.A. Matin; W.P. Vellinga; M.G.D. Geers

doi:10.1109/ESIME.2005.1502855

Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy

E.W.C. Coenen, M.A. Matin, W.P. Vellinga, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

Abstract

Intrinsic thermal fatigue in a mechanically unconstrained Sn-rich Sn-3.8Ag-0.7Cu alloy has been investigated under cyclic thermal loading within the temperature range of 293 K to 353 K. Fatigue damage resulting from this cycling is shown to occur preferentially along some grain boundaries. From a combination of Orientation Imaging Microscopy and Finite Element Modelling it appears that fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.

Original language	English
Title of host publication	Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	497-501
Number of pages	5
ISBN (Print)	0-7803-9062-8, 978-0-7803-9062-1
DOIs	https://doi.org/10.1109/ESIME.2005.1502855
Publication status	Published - 2005
Event	6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2005) - Berlin, Germany Duration: 18 Apr 2005 → 20 Apr 2005 Conference number: 6

Conference

Conference	6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2005)
Abbreviated title	EuroSimE 2005
Country/Territory	Germany
City	Berlin
Period	18/04/05 → 20/04/05

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10.1109/ESIME.2005.1502855

Cite this

Coenen, E. W. C., Matin, M. A., Vellinga, W. P., & Geers, M. G. D. (2005). Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy. In Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 (pp. 497-501). Article 1502855 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ESIME.2005.1502855

Coenen, E.W.C. ; Matin, M.A. ; Vellinga, W.P. et al. / Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy. Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. Piscataway : Institute of Electrical and Electronics Engineers, 2005. pp. 497-501

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title = "Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy",

abstract = "Intrinsic thermal fatigue in a mechanically unconstrained Sn-rich Sn-3.8Ag-0.7Cu alloy has been investigated under cyclic thermal loading within the temperature range of 293 K to 353 K. Fatigue damage resulting from this cycling is shown to occur preferentially along some grain boundaries. From a combination of Orientation Imaging Microscopy and Finite Element Modelling it appears that fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.",

author = "E.W.C. Coenen and M.A. Matin and W.P. Vellinga and M.G.D. Geers",

year = "2005",

doi = "10.1109/ESIME.2005.1502855",

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Coenen, EWC, Matin, MA, Vellinga, WP & Geers, MGD 2005, Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy. in Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005., 1502855, Institute of Electrical and Electronics Engineers, Piscataway, pp. 497-501, 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2005), Berlin, Germany, 18/04/05. https://doi.org/10.1109/ESIME.2005.1502855

Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy. / Coenen, E.W.C.; Matin, M.A.; Vellinga, W.P. et al.
Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. Piscataway: Institute of Electrical and Electronics Engineers, 2005. p. 497-501 1502855.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Coenen EWC, Matin MA, Vellinga WP, Geers MGD. Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy. In Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. Piscataway: Institute of Electrical and Electronics Engineers. 2005. p. 497-501. 1502855 doi: 10.1109/ESIME.2005.1502855

Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy

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