Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy

M.A. Matin, E.W.C. Coenen, W.P. Vellinga, M.G.D. Geers

Research output: Contribution to journalArticleAcademicpeer-review

76 Citations (Scopus)
2 Downloads (Pure)

Abstract

Intrinsic thermal fatigue in a mechanically unconstrained Pb-free, Sn-rich Sn–3.8Ag–0.7Cu alloy has been investigated under cyclic thermal loading between 293 K and 353 K. Fatigue damage is shown to occur preferentially along high angle grain boundaries. From a combination of orientation imaging microscopy and finite element modelling it appears that this fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.
Original languageEnglish
Pages (from-to)927-932
JournalScripta Materialia
Volume53
Issue number8
DOIs
Publication statusPublished - 2005

Fingerprint Dive into the research topics of 'Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy'. Together they form a unique fingerprint.

  • Cite this