Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy

M.A. Matin; E.W.C. Coenen; W.P. Vellinga; M.G.D. Geers

doi:10.1016/j.scriptamat.2005.06.034

Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy

M.A. Matin, E.W.C. Coenen, W.P. Vellinga, M.G.D. Geers

Research output: Contribution to journal › Article › Academic › peer-review

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Abstract

Intrinsic thermal fatigue in a mechanically unconstrained Pb-free, Sn-rich Sn–3.8Ag–0.7Cu alloy has been investigated under cyclic thermal loading between 293 K and 353 K. Fatigue damage is shown to occur preferentially along high angle grain boundaries. From a combination of orientation imaging microscopy and finite element modelling it appears that this fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.

Original language	English
Pages (from-to)	927-932
Journal	Scripta Materialia
Volume	53
Issue number	8
DOIs	https://doi.org/10.1016/j.scriptamat.2005.06.034
Publication status	Published - 2005

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title = "Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy",

abstract = "Intrinsic thermal fatigue in a mechanically unconstrained Pb-free, Sn-rich Sn–3.8Ag–0.7Cu alloy has been investigated under cyclic thermal loading between 293 K and 353 K. Fatigue damage is shown to occur preferentially along high angle grain boundaries. From a combination of orientation imaging microscopy and finite element modelling it appears that this fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.",

author = "M.A. Matin and E.W.C. Coenen and W.P. Vellinga and M.G.D. Geers",

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AU - Matin, M.A.

AU - Coenen, E.W.C.

AU - Vellinga, W.P.

AU - Geers, M.G.D.

PY - 2005

Y1 - 2005

N2 - Intrinsic thermal fatigue in a mechanically unconstrained Pb-free, Sn-rich Sn–3.8Ag–0.7Cu alloy has been investigated under cyclic thermal loading between 293 K and 353 K. Fatigue damage is shown to occur preferentially along high angle grain boundaries. From a combination of orientation imaging microscopy and finite element modelling it appears that this fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.

AB - Intrinsic thermal fatigue in a mechanically unconstrained Pb-free, Sn-rich Sn–3.8Ag–0.7Cu alloy has been investigated under cyclic thermal loading between 293 K and 353 K. Fatigue damage is shown to occur preferentially along high angle grain boundaries. From a combination of orientation imaging microscopy and finite element modelling it appears that this fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.

U2 - 10.1016/j.scriptamat.2005.06.034

DO - 10.1016/j.scriptamat.2005.06.034

M3 - Article

SN - 1359-6462

VL - 53

SP - 927

EP - 932

JO - Scripta Materialia

JF - Scripta Materialia

IS - 8

ER -

Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy

Abstract

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