Correction to: Data-driven aggregate modeling of a semiconductor wafer fab to predict WIP levels and cycle time distributions (Flexible Services and Manufacturing Journal, (2024), 36, 2, (567-596), 10.1007/s10696-023-09501-1)

Research output: Contribution to journalComment/Letter to the editorAcademicpeer-review

28 Downloads (Pure)

Abstract

Correction to: Flexible Services and Manufacturing Journal https://doi.org/10.1007/s10696-023-09501-1 In this article, some minor design changes that have been made to Table 1. These changes aim to enhance the visibility and grouping of layer types within the table, thereby improving its overall clarity. The original article has been corrected. (Table presented.)

Original languageEnglish
Pages (from-to)597-598
Number of pages2
JournalFlexible Services and Manufacturing Journal
Volume36
Issue number2
DOIs
Publication statusPublished - Jun 2024

Cite this