Copper–rubber interface delamination in stretchable electronics

J.P.M. Hoefnagels, J. Neggers, P.H.M. Timmermans, O. Sluis, van der, M.G.D. Geers

Research output: Contribution to journalArticleAcademicpeer-review

30 Citations (Scopus)

Abstract

Interface delamination in metal–rubber-type stretchable electronic systems leads to early failure. This paper reports an investigationof metal–rubber interfaces through in situ scanning electron microscopy imaging of the progressing delamination front of 90 Degreespeel tests of rubber on copper samples. The results show that the energy dissipated in the forming, elongation and rupture of~50 micrometer long fibrils constitutes the major part of the work of separation. The experiments are characterized and modeled usinga cohesive zone-enriched finite-element model.
Original languageEnglish
Pages (from-to)875-878
JournalScripta Materialia
Volume63
Issue number8
DOIs
Publication statusPublished - 2010

Fingerprint Dive into the research topics of 'Copper–rubber interface delamination in stretchable electronics'. Together they form a unique fingerprint.

  • Cite this