Abstract
We report about simulations and measurements on RF-interconnections on SI-InP as well
as on n+-InP wafers. Coplanar waveguides (CPWs) with different metallisation thicknesses
were fabricated and characterized. Propagation losses for narrow CPWs of 1.5 µm Authickness
are 4 dB/cm on SI-InP at 40 GHz and for broad CPWs as low as 1 dB/cm. We tested butt-joint coupling of two different chips by cleaving a chip with CPWs, gluing both parts on a Si-wafer and bonding them to each other. Simulations of these bonded CPWs agree well with measured results.
Original language | English |
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Title of host publication | Proceedings of the 6th annual symposium of the IEEE/LEOS Benelux Chapter, 2 December 2001, Brussels, Belgium |
Editors | F. Berghmans, H. Thienpont, J. Danckaert, L. Desmet |
Place of Publication | Brussels, Belgium |
Publisher | IEEE/LEOS |
Pages | 197-201 |
ISBN (Print) | 90-5487247-0 |
Publication status | Published - 2001 |
Event | 6th Annual Symposium of the IEEE/LEOS Benelux Chapter - Brussels, Belgium Duration: 3 Dec 2001 → 3 Dec 2001 Conference number: 6 |
Conference
Conference | 6th Annual Symposium of the IEEE/LEOS Benelux Chapter |
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Country/Territory | Belgium |
City | Brussels |
Period | 3/12/01 → 3/12/01 |