Coplanar waveguides and butt-joints on InP

J.H. Besten, den; D. Caprioli; R. Pahuta; E. Smalbrugge; T. Vries, de; J.J.M. Kwaspen; A.W. Roodnat; R. Dijk, van; F.E. Vliet, van; X.J.M. Leijtens; M.K. Smit

Coplanar waveguides and butt-joints on InP

J.H. Besten, den, D. Caprioli, R. Pahuta, E. Smalbrugge, T. Vries, de, J.J.M. Kwaspen, A.W. Roodnat, R. Dijk, van, F.E. Vliet, van, X.J.M. Leijtens, M.K. Smit

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Abstract

We report about simulations and measurements on RF-interconnections on SI-InP as well as on n+-InP wafers. Coplanar waveguides (CPWs) with different metallisation thicknesses were fabricated and characterized. Propagation losses for narrow CPWs of 1.5 µm Authickness are 4 dB/cm on SI-InP at 40 GHz and for broad CPWs as low as 1 dB/cm. We tested butt-joint coupling of two different chips by cleaving a chip with CPWs, gluing both parts on a Si-wafer and bonding them to each other. Simulations of these bonded CPWs agree well with measured results.

Original language	English
Title of host publication	Proceedings of the 6th annual symposium of the IEEE/LEOS Benelux Chapter, 2 December 2001, Brussels, Belgium
Editors	F. Berghmans, H. Thienpont, J. Danckaert, L. Desmet
Place of Publication	Brussels, Belgium
Publisher	IEEE/LEOS
Pages	197-201
ISBN (Print)	90-5487247-0
Publication status	Published - 2001
Event	6th Annual Symposium of the IEEE/LEOS Benelux Chapter - Brussels, Belgium Duration: 3 Dec 2001 → 3 Dec 2001 Conference number: 6

Conference

Conference	6th Annual Symposium of the IEEE/LEOS Benelux Chapter
Country	Belgium
City	Brussels
Period	3/12/01 → 3/12/01

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Besten, den, J. H., Caprioli, D., Pahuta, R., Smalbrugge, E., Vries, de, T., Kwaspen, J. J. M., Roodnat, A. W., Dijk, van, R., Vliet, van, F. E., Leijtens, X. J. M., & Smit, M. K. (2001). Coplanar waveguides and butt-joints on InP. In F. Berghmans, H. Thienpont, J. Danckaert, & L. Desmet (Eds.), Proceedings of the 6th annual symposium of the IEEE/LEOS Benelux Chapter, 2 December 2001, Brussels, Belgium (pp. 197-201). IEEE/LEOS.

Besten, den, J.H. ; Caprioli, D. ; Pahuta, R. ; Smalbrugge, E. ; Vries, de, T. ; Kwaspen, J.J.M. ; Roodnat, A.W. ; Dijk, van, R. ; Vliet, van, F.E. ; Leijtens, X.J.M. ; Smit, M.K. / Coplanar waveguides and butt-joints on InP. Proceedings of the 6th annual symposium of the IEEE/LEOS Benelux Chapter, 2 December 2001, Brussels, Belgium. editor / F. Berghmans ; H. Thienpont ; J. Danckaert ; L. Desmet. Brussels, Belgium : IEEE/LEOS, 2001. pp. 197-201

@inproceedings{c9f80bebe0c54168afd88fb75812dc5b,

title = "Coplanar waveguides and butt-joints on InP",

abstract = "We report about simulations and measurements on RF-interconnections on SI-InP as well as on n+-InP wafers. Coplanar waveguides (CPWs) with different metallisation thicknesses were fabricated and characterized. Propagation losses for narrow CPWs of 1.5 µm Authickness are 4 dB/cm on SI-InP at 40 GHz and for broad CPWs as low as 1 dB/cm. We tested butt-joint coupling of two different chips by cleaving a chip with CPWs, gluing both parts on a Si-wafer and bonding them to each other. Simulations of these bonded CPWs agree well with measured results.",

author = "{Besten, den}, J.H. and D. Caprioli and R. Pahuta and E. Smalbrugge and {Vries, de}, T. and J.J.M. Kwaspen and A.W. Roodnat and {Dijk, van}, R. and {Vliet, van}, F.E. and X.J.M. Leijtens and M.K. Smit",

year = "2001",

language = "English",

isbn = "90-5487247-0",

pages = "197--201",

editor = "F. Berghmans and H. Thienpont and J. Danckaert and L. Desmet",

booktitle = "Proceedings of the 6th annual symposium of the IEEE/LEOS Benelux Chapter, 2 December 2001, Brussels, Belgium",

publisher = "IEEE/LEOS",

note = "6th Annual Symposium of the IEEE/LEOS Benelux Chapter ; Conference date: 03-12-2001 Through 03-12-2001",

}

Besten, den, JH, Caprioli, D, Pahuta, R, Smalbrugge, E, Vries, de, T, Kwaspen, JJM, Roodnat, AW, Dijk, van, R, Vliet, van, FE, Leijtens, XJM & Smit, MK 2001, Coplanar waveguides and butt-joints on InP. in F Berghmans, H Thienpont, J Danckaert & L Desmet (eds), Proceedings of the 6th annual symposium of the IEEE/LEOS Benelux Chapter, 2 December 2001, Brussels, Belgium. IEEE/LEOS, Brussels, Belgium, pp. 197-201, 6th Annual Symposium of the IEEE/LEOS Benelux Chapter, Brussels, Belgium, 3/12/01.

Coplanar waveguides and butt-joints on InP. / Besten, den, J.H.; Caprioli, D.; Pahuta, R.; Smalbrugge, E.; Vries, de, T.; Kwaspen, J.J.M.; Roodnat, A.W.; Dijk, van, R.; Vliet, van, F.E.; Leijtens, X.J.M.; Smit, M.K.

Proceedings of the 6th annual symposium of the IEEE/LEOS Benelux Chapter, 2 December 2001, Brussels, Belgium. ed. / F. Berghmans; H. Thienpont; J. Danckaert; L. Desmet. Brussels, Belgium : IEEE/LEOS, 2001. p. 197-201.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Coplanar waveguides and butt-joints on InP

AU - Besten, den, J.H.

AU - Caprioli, D.

AU - Pahuta, R.

AU - Smalbrugge, E.

AU - Vries, de, T.

AU - Kwaspen, J.J.M.

AU - Roodnat, A.W.

AU - Dijk, van, R.

AU - Vliet, van, F.E.

AU - Leijtens, X.J.M.

AU - Smit, M.K.

N1 - Conference code: 6

PY - 2001

Y1 - 2001

N2 - We report about simulations and measurements on RF-interconnections on SI-InP as well as on n+-InP wafers. Coplanar waveguides (CPWs) with different metallisation thicknesses were fabricated and characterized. Propagation losses for narrow CPWs of 1.5 µm Authickness are 4 dB/cm on SI-InP at 40 GHz and for broad CPWs as low as 1 dB/cm. We tested butt-joint coupling of two different chips by cleaving a chip with CPWs, gluing both parts on a Si-wafer and bonding them to each other. Simulations of these bonded CPWs agree well with measured results.

AB - We report about simulations and measurements on RF-interconnections on SI-InP as well as on n+-InP wafers. Coplanar waveguides (CPWs) with different metallisation thicknesses were fabricated and characterized. Propagation losses for narrow CPWs of 1.5 µm Authickness are 4 dB/cm on SI-InP at 40 GHz and for broad CPWs as low as 1 dB/cm. We tested butt-joint coupling of two different chips by cleaving a chip with CPWs, gluing both parts on a Si-wafer and bonding them to each other. Simulations of these bonded CPWs agree well with measured results.

M3 - Conference contribution

SN - 90-5487247-0

SP - 197

EP - 201

BT - Proceedings of the 6th annual symposium of the IEEE/LEOS Benelux Chapter, 2 December 2001, Brussels, Belgium

A2 - Berghmans, F.

A2 - Thienpont, H.

A2 - Danckaert, J.

A2 - Desmet, L.

PB - IEEE/LEOS

CY - Brussels, Belgium

T2 - 6th Annual Symposium of the IEEE/LEOS Benelux Chapter

Y2 - 3 December 2001 through 3 December 2001

ER -