Abstract
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 6th annual symposium of the IEEE/LEOS Benelux Chapter, 2 December 2001, Brussels, Belgium |
| Editors | F. Berghmans, H. Thienpont, J. Danckaert, L. Desmet |
| Place of Publication | Brussels, Belgium |
| Publisher | IEEE/LEOS |
| Pages | 197-201 |
| ISBN (Print) | 90-5487247-0 |
| Publication status | Published - 2001 |
| Event | 6th Annual Symposium of the IEEE/LEOS Benelux Chapter - Brussels, Belgium Duration: 3 Dec 2001 → 3 Dec 2001 Conference number: 6 |
Conference
| Conference | 6th Annual Symposium of the IEEE/LEOS Benelux Chapter |
|---|---|
| Country | Belgium |
| City | Brussels |
| Period | 3/12/01 → 3/12/01 |
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Coplanar waveguides and butt-joints on InP. / Besten, den, J.H.; Caprioli, D.; Pahuta, R.; Smalbrugge, E.; Vries, de, T.; Kwaspen, J.J.M.; Roodnat, A.W.; Dijk, van, R.; Vliet, van, F.E.; Leijtens, X.J.M.; Smit, M.K.
Proceedings of the 6th annual symposium of the IEEE/LEOS Benelux Chapter, 2 December 2001, Brussels, Belgium. ed. / F. Berghmans; H. Thienpont; J. Danckaert; L. Desmet. Brussels, Belgium : IEEE/LEOS, 2001. p. 197-201.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review
TY - GEN
T1 - Coplanar waveguides and butt-joints on InP
AU - Besten, den, J.H.
AU - Caprioli, D.
AU - Pahuta, R.
AU - Smalbrugge, E.
AU - Vries, de, T.
AU - Kwaspen, J.J.M.
AU - Roodnat, A.W.
AU - Dijk, van, R.
AU - Vliet, van, F.E.
AU - Leijtens, X.J.M.
AU - Smit, M.K.
PY - 2001
Y1 - 2001
N2 - We report about simulations and measurements on RF-interconnections on SI-InP as well as on n+-InP wafers. Coplanar waveguides (CPWs) with different metallisation thicknesses were fabricated and characterized. Propagation losses for narrow CPWs of 1.5 µm Authickness are 4 dB/cm on SI-InP at 40 GHz and for broad CPWs as low as 1 dB/cm. We tested butt-joint coupling of two different chips by cleaving a chip with CPWs, gluing both parts on a Si-wafer and bonding them to each other. Simulations of these bonded CPWs agree well with measured results.
AB - We report about simulations and measurements on RF-interconnections on SI-InP as well as on n+-InP wafers. Coplanar waveguides (CPWs) with different metallisation thicknesses were fabricated and characterized. Propagation losses for narrow CPWs of 1.5 µm Authickness are 4 dB/cm on SI-InP at 40 GHz and for broad CPWs as low as 1 dB/cm. We tested butt-joint coupling of two different chips by cleaving a chip with CPWs, gluing both parts on a Si-wafer and bonding them to each other. Simulations of these bonded CPWs agree well with measured results.
M3 - Conference contribution
SN - 90-5487247-0
SP - 197
EP - 201
BT - Proceedings of the 6th annual symposium of the IEEE/LEOS Benelux Chapter, 2 December 2001, Brussels, Belgium
A2 - Berghmans, F.
A2 - Thienpont, H.
A2 - Danckaert, J.
A2 - Desmet, L.
PB - IEEE/LEOS
CY - Brussels, Belgium
ER -