Coplanar waveguides and butt-joints on InP

J.H. Besten, den, D. Caprioli, R. Pahuta, E. Smalbrugge, T. Vries, de, J.J.M. Kwaspen, A.W. Roodnat, R. Dijk, van, F.E. Vliet, van, X.J.M. Leijtens, M.K. Smit

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We report about simulations and measurements on RF-interconnections on SI-InP as well as on n+-InP wafers. Coplanar waveguides (CPWs) with different metallisation thicknesses were fabricated and characterized. Propagation losses for narrow CPWs of 1.5 µm Authickness are 4 dB/cm on SI-InP at 40 GHz and for broad CPWs as low as 1 dB/cm. We tested butt-joint coupling of two different chips by cleaving a chip with CPWs, gluing both parts on a Si-wafer and bonding them to each other. Simulations of these bonded CPWs agree well with measured results.
Original languageEnglish
Title of host publicationProceedings of the 6th annual symposium of the IEEE/LEOS Benelux Chapter, 2 December 2001, Brussels, Belgium
EditorsF. Berghmans, H. Thienpont, J. Danckaert, L. Desmet
Place of PublicationBrussels, Belgium
ISBN (Print)90-5487247-0
Publication statusPublished - 2001
Event6th Annual Symposium of the IEEE/LEOS Benelux Chapter - Brussels, Belgium
Duration: 3 Dec 20013 Dec 2001
Conference number: 6


Conference6th Annual Symposium of the IEEE/LEOS Benelux Chapter


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