Original language | English |
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Title of host publication | Proceedings of the TechConnect World Innovation Conference & Expo, 22-25 May 2016, Washington, USA |
Pages | 1-4 |
Publication status | Published - 2016 |
Contributions of the main flour constituents to dough rheology, and implications for dough quality and its assessment
M. Meerts, R.M. Cardinaels, F. Oosterlinck, C. Courtin, P. Moldenaers
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic
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