Conformal slip-free wafer chucking using an actuated wafer table

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Abstract

In semiconductor applications, such as photolithog-raphy and wafer inspection, friction forces and related slip during wafer loading and chucking at the wafer table are known to cause non-reproducible wafer deformations that result in errors between successive processing steps. To minimize these so-called overlay errors, a modified wafer table design is proposed, which can be actuated in various orthogonal low order deformation shapes that are conformal to the shape of the wafer prior to loading. According to the simulation results, the required out of plane deformation for conformal loading can be achieved and the in-plane friction forces can be reduced significantly by matching the neutral plane of the actuated wafer table and the wafer. The actuator print-through effects, however, need further attention.
Original languageEnglish
Title of host publication2019 7th International Conference on Control, Mechatronics and Automation (ICCMA)
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages278-282
Number of pages5
ISBN (Electronic)978-1-7281-3787-2
DOIs
Publication statusPublished - 10 Feb 2020
Event7th International Conference on Control, Mechatronics and Automation (ICCMA) - Delft, Netherlands
Duration: 6 Nov 20198 Nov 2019

Conference

Conference7th International Conference on Control, Mechatronics and Automation (ICCMA)
CountryNetherlands
CityDelft
Period6/11/198/11/19

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Keywords

  • overlay
  • wafer shape
  • wafer chucking
  • in-plane deformation
  • unimorph
  • Piezo actuators

Cite this

Hermanussen, S. J., Habets, M. B. I., Heertjes, M. F., & Vermeulen, J. P. M. B. (2020). Conformal slip-free wafer chucking using an actuated wafer table. In 2019 7th International Conference on Control, Mechatronics and Automation (ICCMA) (pp. 278-282). [8988610] Piscataway: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ICCMA46720.2019.8988610