Comparison of optical passive integrated devices based on three materials for optical clock distribution

B. Han; R. Orobtchouk; T. Benyattou; P.R.A. Binetti; S. Jeannot; J.-M. Fédéli; X.J.M. Leijtens

Comparison of optical passive integrated devices based on three materials for optical clock distribution

B. Han, R. Orobtchouk, T. Benyattou, P.R.A. Binetti, S. Jeannot, J.-M. Fédéli, X.J.M. Leijtens

Photonic Integration

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

20 Citations (Scopus)

Abstract

We report different passive integrated devices characterization based on three materials (SOI, a-Si:H and SiNx) for the realization of an optical compact link compatible with CMOS technology. The low level of losses obtained on the passive elementary components for the optical link (strip guides, micro bend and MMI beam splitter) shows the feasibility of photonic integration on silicon using amorphous silicon.

Original language	English
Title of host publication	Proceedings of the 13th European Conference on Integrated Optics (ECIO 2007) 25-27 April 2007, Copenhagen, Denmark
Pages	1-4
Publication status	Published - 2007
Event	13th European Conference on Integrated Optics (ECIO 2007) - Copenhagen, Denmark Duration: 25 Apr 2007 → 27 Apr 2007 Conference number: 13

Conference

Conference	13th European Conference on Integrated Optics (ECIO 2007)
Abbreviated title	ECIO 2007
Country	Denmark
City	Copenhagen
Period	25/04/07 → 27/04/07

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@inproceedings{fb5b3fcd743d4a15986b7d8243ff648c,

title = "Comparison of optical passive integrated devices based on three materials for optical clock distribution",

abstract = "We report different passive integrated devices characterization based on three materials (SOI, a-Si:H and SiNx) for the realization of an optical compact link compatible with CMOS technology. The low level of losses obtained on the passive elementary components for the optical link (strip guides, micro bend and MMI beam splitter) shows the feasibility of photonic integration on silicon using amorphous silicon.",

author = "B. Han and R. Orobtchouk and T. Benyattou and P.R.A. Binetti and S. Jeannot and J.-M. F{\'e}d{\'e}li and X.J.M. Leijtens",

year = "2007",

language = "English",

pages = "1--4",

booktitle = "Proceedings of the 13th European Conference on Integrated Optics (ECIO 2007) 25-27 April 2007, Copenhagen, Denmark",

note = "13th European Conference on Integrated Optics (ECIO 2007), ECIO 2007 ; Conference date: 25-04-2007 Through 27-04-2007",

}

Han, B, Orobtchouk, R, Benyattou, T, Binetti, PRA, Jeannot, S, Fédéli, J-M & Leijtens, XJM 2007, Comparison of optical passive integrated devices based on three materials for optical clock distribution. in Proceedings of the 13th European Conference on Integrated Optics (ECIO 2007) 25-27 April 2007, Copenhagen, Denmark., ThF3, pp. 1-4, 13th European Conference on Integrated Optics (ECIO 2007), Copenhagen, Denmark, 25/04/07.

Comparison of optical passive integrated devices based on three materials for optical clock distribution. / Han, B.; Orobtchouk, R.; Benyattou, T.; Binetti, P.R.A.; Jeannot, S.; Fédéli, J.-M.; Leijtens, X.J.M.

Proceedings of the 13th European Conference on Integrated Optics (ECIO 2007) 25-27 April 2007, Copenhagen, Denmark. 2007. p. 1-4 ThF3.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Comparison of optical passive integrated devices based on three materials for optical clock distribution

AU - Han, B.

AU - Orobtchouk, R.

AU - Benyattou, T.

AU - Binetti, P.R.A.

AU - Jeannot, S.

AU - Fédéli, J.-M.

AU - Leijtens, X.J.M.

N1 - Conference code: 13

PY - 2007

Y1 - 2007

N2 - We report different passive integrated devices characterization based on three materials (SOI, a-Si:H and SiNx) for the realization of an optical compact link compatible with CMOS technology. The low level of losses obtained on the passive elementary components for the optical link (strip guides, micro bend and MMI beam splitter) shows the feasibility of photonic integration on silicon using amorphous silicon.

AB - We report different passive integrated devices characterization based on three materials (SOI, a-Si:H and SiNx) for the realization of an optical compact link compatible with CMOS technology. The low level of losses obtained on the passive elementary components for the optical link (strip guides, micro bend and MMI beam splitter) shows the feasibility of photonic integration on silicon using amorphous silicon.

M3 - Conference contribution

SP - 1

EP - 4

BT - Proceedings of the 13th European Conference on Integrated Optics (ECIO 2007) 25-27 April 2007, Copenhagen, Denmark

T2 - 13th European Conference on Integrated Optics (ECIO 2007)

Y2 - 25 April 2007 through 27 April 2007

ER -