Abstract
We report different passive integrated devices characterization based on three materials
(SOI, a-Si:H and SiNx) for the realization of an optical compact link compatible with CMOS
technology. The low level of losses obtained on the passive elementary components for the optical link (strip guides, micro bend and MMI beam splitter) shows the feasibility of photonic integration on silicon using amorphous silicon.
Original language | English |
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Title of host publication | Proceedings of the 13th European Conference on Integrated Optics (ECIO 2007) 25-27 April 2007, Copenhagen, Denmark |
Pages | 1-4 |
Publication status | Published - 2007 |
Event | 13th European Conference on Integrated Optics (ECIO 2007) - Copenhagen, Denmark Duration: 25 Apr 2007 → 27 Apr 2007 Conference number: 13 |
Conference
Conference | 13th European Conference on Integrated Optics (ECIO 2007) |
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Abbreviated title | ECIO 2007 |
Country/Territory | Denmark |
City | Copenhagen |
Period | 25/04/07 → 27/04/07 |