Abstract
A low noise amplifier (LNA) realized in CMOS technology operating in the 60 GHz band has been packaged in gap-waveguide technology. The bare die LNA is implemented in 40 nm digital CMOS technology. The chip interface is wire-bonded to a PCB employing a contactless connection to a metal waveguide. The co-simulation results of the back-to-back combined LNA-waveguide structure features a system available gain of 10.5 dB and a noise figure NF of 4.63 dB, which is comparable to the isolated LNA performance (12.8 dB available gain, 3.95 dB NF).
Original language | English |
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Title of host publication | 12th European Conference on Antennas and Propagation (EuCAP 2018) |
Publisher | Institution of Engineering and Technology |
Number of pages | 4 |
ISBN (Electronic) | 978-1-78561-816-1 |
ISBN (Print) | 978-1-78561-815-4 |
DOIs | |
Publication status | Published - Apr 2018 |
Event | 12th European Conference on Antennas and Propagation (EuCAP 2018) - London, United Kingdom Duration: 9 Apr 2018 → 13 Apr 2018 Conference number: 12 http://www.eucap2018.org/ |
Conference
Conference | 12th European Conference on Antennas and Propagation (EuCAP 2018) |
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Abbreviated title | EuCAP 2018 |
Country/Territory | United Kingdom |
City | London |
Period | 9/04/18 → 13/04/18 |
Internet address |
Keywords
- Millimeter-wave (mm-wave), 5G, CMOS, electromagnetic packaging, waveguide transitions, gap waveguide technology, system integration.
- Waveguide transitions
- CMOS
- 5G
- System integration
- Gap waveguide technology
- Electromagnetic packaging
- Millimeter-wave (mm-wave)