Co-simulation results of a 60 GHz CMOS LNA integrated and packaged in gap-waveguide technology

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Abstract

A low noise amplifier (LNA) realized in CMOS technology operating in the 60 GHz band has been packaged in gap-waveguide technology. The bare die LNA is implemented in 40 nm digital CMOS technology. The chip interface is wire-bonded to a PCB employing a contactless connection to a metal waveguide. The co-simulation results of the back-to-back combined LNA-waveguide structure features a system available gain of 10.5 dB and a noise figure NF of 4.63 dB, which is comparable to the isolated LNA performance (12.8 dB available gain, 3.95 dB NF).
Original languageEnglish
Title of host publication12th European Conference on Antennas and Propagation (EuCAP 2018)
PublisherInstitution of Engineering and Technology (IET)
Number of pages4
ISBN (Electronic)978-1-78561-816-1
ISBN (Print)978-1-78561-815-4
DOIs
Publication statusPublished - Apr 2018
Event12th European Conference on Antennas and Propagation, (EuCAP 2018) - London, United Kingdom
Duration: 9 Apr 201813 Apr 2018
Conference number: 12
http://www.eucap2018.org/

Conference

Conference12th European Conference on Antennas and Propagation, (EuCAP 2018)
Abbreviated titleEuCAP 2018
CountryUnited Kingdom
CityLondon
Period9/04/1813/04/18
Internet address

Keywords

  • Millimeter-wave (mm-wave), 5G, CMOS, electromagnetic packaging, waveguide transitions, gap waveguide technology, system integration.
  • Waveguide transitions
  • CMOS
  • 5G
  • System integration
  • Gap waveguide technology
  • Electromagnetic packaging
  • Millimeter-wave (mm-wave)

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