Co-Packaged Optics with Multimode Fiber Interface Employing 2-D VCSEL Matrix

Chenhui Li (Corresponding author), Haoshuo Chen (Corresponding author), Nicolas Keith Fontaine, Bob Farah, Cristian Bolle, Roland Ryf, Mikael Mazur, Oded Raz, Christian Neumeyr, Juan Carlos Alvarado-Zacarias, Rodrigo Amezcua Correa, Marianne Bigot-Astruc, Pierre Sillard, David Neilson

Research output: Contribution to journalArticleAcademicpeer-review

3 Citations (Scopus)
338 Downloads (Pure)

Abstract

We propose and demonstrate a mode-division-multiplexed transmitter by employing a VCSEL-based 2-D matrix and a multi-plane light converter (MPLC). The triangular matrix light spots from VCSELs are designed with a 250-μ pitch in both x- and y- directions for scalable and low-loss mode multiplexing. The VCSELs are directly modulated by co-packaged BiCMOS drivers on a silicon interposer, fabricated on a wafer level. The MPLC is utilized to form seven phase masks to convert the individual Gaussian beams to multiplex Hermite-Gaussian modes, which can be coupled into a multi-mode fiber. In the demonstration, we packaged ten 10-G class VCSELs with the drivers, and the form factor of the co-packaged optics is 10-mm × 10-mm. With the fan-out evaluation board, the sub-module is characterized for short and long transmissions by multiplexing the ten directly modulated outputs from VCSELs. The testing results indicate 200-Gb/s capacity over 100-m MMF with direct detection and 28-km few-mode fiber with coherent detection.

Original languageEnglish
Pages (from-to)3325-3330
Number of pages6
JournalJournal of Lightwave Technology
Volume40
Issue number10
Early online date22 Mar 2022
DOIs
Publication statusPublished - 15 May 2022

Funding

FundersFunder number
European Union 's Horizon 2020 - Research and Innovation Framework Programme
Horizon 2020780326

    Keywords

    • Layout
    • Mode division multiplexing
    • Multiplexing
    • Optical interconnections
    • Optical transmitters
    • Silicon
    • Transmission line matrix methods
    • VCSEL
    • Vertical cavity surface emitting lasers
    • co-packaged optics
    • silicon interposer
    • mode division multiplexing

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