Chip-to-chip interconnects based on 3D stacking of opto-electrical dies on Si

Engineering

• Interconnects 100%
• Waveguide 100%
• Applicability 33%
• Receiver Sensitivity 33%
• Metal Layer 33%
• Photodiode 33%
• Silicon Substrate 33%
• Multimode Fiber 33%
• Optical Link 33%
• Test Sample 33%
• Optical Interconnection 33%
• Processing Technology 33%
• Bonding Wire 33%
• Bandwidth Density 33%
• Photoresist 33%

Physics

• Waveguide 100%
• Stacking 100%
• Optical Interconnection 50%
• Planar Waveguide 50%
• Photodiode 50%
• Chips (Electronics) 50%

Material Science

• Waveguide 100%
• Electronic Circuit 66%
• Silicon 33%
• Density 33%
• Optical Interconnection 33%