Chip-to-chip interconnects based on 3D stacking of opto-electrical dies on Si

P. Duan, O. Raz, B.E. Smalbrugge, J. Duis, H.J.S. Dorren

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

2 Citations (Scopus)

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Physics & Astronomy