Chip health tracking using dynamic in-situ delay monitoring

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1 Citation (Scopus)

Abstract

Tracking the gradual effect of silicon aging requires fine-grain slack monitoring. Conventional slack monitoring techniques intend to measure worst-case static slack, i.e. the slack of longest timing path. In sharp contrast to the conventional techniques, we propose a novel technique that is based on dynamic excitation of in-situ delay monitors, i.e. dynamic excitation of the timing paths that are monitored. As the delays degrade, the path delays increase and the monitors are excited more frequently. With the proposed technique, a fine-grained signature of the delay degradation is extracted from the excitation rate of monitors.

Original languageEnglish
Title of host publicationProceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
PublisherInstitute of Electrical and Electronics Engineers
Pages304-307
Number of pages4
ISBN (Electronic)9783981926323
DOIs
Publication statusPublished - 14 May 2019
Event22nd Design, Automation and Test in Europe Conference and Exhibition, DATE 2019 - Florence, Italy
Duration: 25 Mar 201929 Mar 2019

Conference

Conference22nd Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
Abbreviated titleDATE2019
CountryItaly
CityFlorence
Period25/03/1929/03/19

Keywords

  • delay testing
  • in-situ monitoring
  • reliability
  • silicon aging

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  • Cite this

    Balef, H. A., Goossens, K., & de Gyvez, J. P. (2019). Chip health tracking using dynamic in-situ delay monitoring. In Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019 (pp. 304-307). [8715014] Institute of Electrical and Electronics Engineers. https://doi.org/10.23919/DATE.2019.8715014