Abstract
Tracking the gradual effect of silicon aging requires fine-grain slack monitoring. Conventional slack monitoring techniques intend to measure worst-case static slack, i.e. the slack of longest timing path. In sharp contrast to the conventional techniques, we propose a novel technique that is based on dynamic excitation of in-situ delay monitors, i.e. dynamic excitation of the timing paths that are monitored. As the delays degrade, the path delays increase and the monitors are excited more frequently. With the proposed technique, a fine-grained signature of the delay degradation is extracted from the excitation rate of monitors.
Original language | English |
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Title of host publication | Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019 |
Publisher | Institute of Electrical and Electronics Engineers |
Pages | 304-307 |
Number of pages | 4 |
ISBN (Electronic) | 9783981926323 |
DOIs | |
Publication status | Published - 14 May 2019 |
Event | 22nd Design, Automation and Test in Europe Conference and Exhibition (DATE 2019) - Florence, Italy, Florence, Italy Duration: 25 Mar 2019 → 29 Mar 2019 Conference number: 22 |
Conference
Conference | 22nd Design, Automation and Test in Europe Conference and Exhibition (DATE 2019) |
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Abbreviated title | DATE 2019 |
Country/Territory | Italy |
City | Florence |
Period | 25/03/19 → 29/03/19 |
Keywords
- delay testing
- in-situ monitoring
- reliability
- silicon aging