Abstract
In this paper we determined the water uptake of a die attach and a molding compound. The two types of polymer which were selected are a die attach filled with silver particles and an epoxy molding compound filled with silica particles. The water absorption is carried out in an adjustable thermal and humidity chamber, SGA-100, at different temperatures and humidity levels. Moisture absorption equilibriumof test data were obtained by experiment. The moisture absorption equilibrium prediction equation was modeled by using the extrapolated experimental data. Diffusion coefficients at different temperature were obtained from the moisture absorption experiments.
| Original language | English |
|---|---|
| Pages (from-to) | 1685-1689 |
| Journal | Microelectronics Reliability |
| Volume | 47 |
| Issue number | 9-11 |
| DOIs | |
| Publication status | Published - 2007 |