Characterization of moisture properties of polymers for IC packaging

X.S. Ma, K.M.B. Jansen, L.J. Ernst, W.D. Driel, van, O. Sluis, van der, G.Q. Zhang

Research output: Contribution to journalArticleAcademicpeer-review

11 Citations (Scopus)

Abstract

In this paper we determined the water uptake of a die attach and a molding compound. The two types of polymer which were selected are a die attach filled with silver particles and an epoxy molding compound filled with silica particles. The water absorption is carried out in an adjustable thermal and humidity chamber, SGA-100, at different temperatures and humidity levels. Moisture absorption equilibriumof test data were obtained by experiment. The moisture absorption equilibrium prediction equation was modeled by using the extrapolated experimental data. Diffusion coefficients at different temperature were obtained from the moisture absorption experiments.
Original languageEnglish
Pages (from-to)1685-1689
JournalMicroelectronics and Reliability : an International Journal and World Abstracting Service
Volume47
Issue number9-11
DOIs
Publication statusPublished - 2007

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