Characterization of carbon nitride thin films deposited by a combined RF and DC plasma beam

Thin carbon nitride films have been deposited on silicon(100) substrates downstream of a nitrogen plasma beam generated in a combined RF (13.56 MHz, 40–50 W) and DC (voltage ±200 V, power 1–10 W) discharge between a graphite electrode and a graphite nozzle. By combining the RF and DC sources the capability of RF field to create extended plasmas is used together with the enhanced sputtering and biasing effect of the DC source. The plasma characteristics (electron temperature, presence of molecular species) have been studied by optical emission spectroscopy. Deposition rates of 2.5–3 nm/s are obtained at the centre of the plasma beam and at a few centimetres distance from the nozzle. The films have been investigated by X-ray photoelectron spectroscopy, spectroscopic ellipsometry, scanning and transmission electron microscopy, and microhardness measurements. The films have an overall N:C ratio of 0.28 but the distribution of different nitrogen bonds depends upon the DC bias conditions. In the spectral range 0.3–0.7 µm the refractive index increases slightly from 1.5 to 2.2. The films are amorphous, with morphology consisting of a columnar structure. The columns have a diameter of about 20 nm. A hardness of 24 GPa has been measured.