TY - JOUR
T1 - Characterization of a vacuum-arc discharge in tin vapor using time-resolved plasma imaging and extreme ultraviolet spectrometry
AU - Kieft, E.R.
AU - Mullen, van der, J.J.A.M.
AU - Kroesen, G.M.W.
AU - Banine, V.Y.
AU - Koshelev, K.N.
PY - 2005
Y1 - 2005
N2 - Discharge sources in tin vapor have recently been receiving increased attention as candidate extreme ultraviolet (EUV) light sources for application in semiconductor lithography, because of their favorable spectrum near 13.5 nm. In the ASML EUV laboratory, time-resolved pinhole imaging in the EUV and two-dimensional imaging in visible light have been applied for qualitative characterization of the evolution of a vacuum-arc tin vapor discharge. An EUV spectrometer has been used to find the dominant ionization stages of tin as a function of time during the plasma evolution of the discharge.
AB - Discharge sources in tin vapor have recently been receiving increased attention as candidate extreme ultraviolet (EUV) light sources for application in semiconductor lithography, because of their favorable spectrum near 13.5 nm. In the ASML EUV laboratory, time-resolved pinhole imaging in the EUV and two-dimensional imaging in visible light have been applied for qualitative characterization of the evolution of a vacuum-arc tin vapor discharge. An EUV spectrometer has been used to find the dominant ionization stages of tin as a function of time during the plasma evolution of the discharge.
U2 - 10.1103/PhysRevE.71.026409
DO - 10.1103/PhysRevE.71.026409
M3 - Article
C2 - 15783431
VL - 71
SP - 026409-1/7
JO - Physical Review E - Statistical, Nonlinear, and Soft Matter Physics
JF - Physical Review E - Statistical, Nonlinear, and Soft Matter Physics
SN - 1539-3755
IS - 2
M1 - 026409
ER -