Characterization and modelling of moisture absorption of underfill for IC packaging

X.S. Ma, K.M.B. Jansen, L.J. Ernst, W.D. Driel, van, O. Sluis, van der, G.Q. Zhang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proceedings of the Electronic Components and Technology Conference (ECTC 2007), United States, Reno, Nevada
Pages	350-355
Publication status	Published - 2007

Cite this

@inproceedings{8502848ea30d4f64b97d4f2993fe53d0,

title = "Characterization and modelling of moisture absorption of underfill for IC packaging",

author = "X.S. Ma and K.M.B. Jansen and L.J. Ernst and {Driel, van}, W.D. and {Sluis, van der}, O. and G.Q. Zhang",

year = "2007",

language = "English",

pages = "350--355",

booktitle = "Proceedings of the Electronic Components and Technology Conference (ECTC 2007), United States, Reno, Nevada",

}

Characterization and modelling of moisture absorption of underfill for IC packaging. / Ma, X.S.; Jansen, K.M.B.; Ernst, L.J. et al.
Proceedings of the Electronic Components and Technology Conference (ECTC 2007), United States, Reno, Nevada. 2007. p. 350-355.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Characterization and modelling of moisture absorption of underfill for IC packaging

AU - Ma, X.S.

AU - Jansen, K.M.B.

AU - Ernst, L.J.

AU - Driel, van, W.D.

AU - Sluis, van der, O.

AU - Zhang, G.Q.

PY - 2007

Y1 - 2007

M3 - Conference contribution

SP - 350

EP - 355

BT - Proceedings of the Electronic Components and Technology Conference (ECTC 2007), United States, Reno, Nevada

ER -