Characterization and modelling of moisture absorption of underfill for IC packaging

X.S. Ma, K.M.B. Jansen, L.J. Ernst, W.D. Driel, van, O. Sluis, van der, G.Q. Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

18 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings of the Electronic Components and Technology Conference (ECTC 2007), United States, Reno, Nevada
Pages350-355
Publication statusPublished - 2007

Cite this

Ma, X. S., Jansen, K. M. B., Ernst, L. J., Driel, van, W. D., Sluis, van der, O., & Zhang, G. Q. (2007). Characterization and modelling of moisture absorption of underfill for IC packaging. In Proceedings of the Electronic Components and Technology Conference (ECTC 2007), United States, Reno, Nevada (pp. 350-355)