Characterization and modelling of moisture absorption of underfill for IC packaging

X.S. Ma, K.M.B. Jansen, L.J. Ernst, W.D. Driel, van, O. Sluis, van der, G.Q. Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Original languageEnglish
Title of host publicationProceedings of the Electronic Components and Technology Conference (ECTC 2007), United States, Reno, Nevada
Publication statusPublished - 2007

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