Capacity calculation of an AGV system in a MP2 wafer fab by means of simulation

M. Rooney; M. Burgt, van der; T. Smit; J.E. Rooda

Capacity calculation of an AGV system in a MP2 wafer fab by means of simulation

M. Rooney
, M. Burgt, van der
, T. Smit
, J.E. Rooda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

Abstract

The transport of wafers inside a multiprocess multiproduct wafer factory is a complex logistic process. In Philips' MOS-3 waferfab this transport is carried out by a so-called automated guided vehicle (AGV) system. In this paper a dynamic model is presented of the AGV system of MOS-3. The advantages of creating such a model are twofold. First of all, the model can be used to analyse the logistics, layout, algorithms and behaviour of the current AGV system. Secondly, the model can analyse and optimise possible changes that can be made to the AGV system in the future

Original language	English
Title of host publication	Conference proceedings 2001 IEEE international symposium on semiconductor manufacturing (ISSM 2001) : October 8-10, 2001, San Jose, California
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	385-388
ISBN (Print)	0-7803-6731-6
Publication status	Published - 2001

Cite this

@inproceedings{dc0cf6bac7a74b089dacf319569d50d7,

title = "Capacity calculation of an AGV system in a MP2 wafer fab by means of simulation",

abstract = "The transport of wafers inside a multiprocess multiproduct wafer factory is a complex logistic process. In Philips' MOS-3 waferfab this transport is carried out by a so-called automated guided vehicle (AGV) system. In this paper a dynamic model is presented of the AGV system of MOS-3. The advantages of creating such a model are twofold. First of all, the model can be used to analyse the logistics, layout, algorithms and behaviour of the current AGV system. Secondly, the model can analyse and optimise possible changes that can be made to the AGV system in the future",

author = "M. Rooney and \{Burgt, van der\}, M. and T. Smit and J.E. Rooda",

year = "2001",

language = "English",

isbn = "0-7803-6731-6",

pages = "385--388",

booktitle = "Conference proceedings 2001 IEEE international symposium on semiconductor manufacturing (ISSM 2001) : October 8-10, 2001, San Jose, California",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

}

Capacity calculation of an AGV system in a MP2 wafer fab by means of simulation. / Rooney, M.; Burgt, van der, M.; Smit, T. et al.
Conference proceedings 2001 IEEE international symposium on semiconductor manufacturing (ISSM 2001) : October 8-10, 2001, San Jose, California. Piscataway: Institute of Electrical and Electronics Engineers, 2001. p. 385-388.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

TY - GEN

T1 - Capacity calculation of an AGV system in a MP2 wafer fab by means of simulation

AU - Rooney, M.

AU - Burgt, van der, M.

AU - Smit, T.

AU - Rooda, J.E.

PY - 2001

Y1 - 2001

N2 - The transport of wafers inside a multiprocess multiproduct wafer factory is a complex logistic process. In Philips' MOS-3 waferfab this transport is carried out by a so-called automated guided vehicle (AGV) system. In this paper a dynamic model is presented of the AGV system of MOS-3. The advantages of creating such a model are twofold. First of all, the model can be used to analyse the logistics, layout, algorithms and behaviour of the current AGV system. Secondly, the model can analyse and optimise possible changes that can be made to the AGV system in the future

AB - The transport of wafers inside a multiprocess multiproduct wafer factory is a complex logistic process. In Philips' MOS-3 waferfab this transport is carried out by a so-called automated guided vehicle (AGV) system. In this paper a dynamic model is presented of the AGV system of MOS-3. The advantages of creating such a model are twofold. First of all, the model can be used to analyse the logistics, layout, algorithms and behaviour of the current AGV system. Secondly, the model can analyse and optimise possible changes that can be made to the AGV system in the future

M3 - Conference contribution

SN - 0-7803-6731-6

SP - 385

EP - 388

BT - Conference proceedings 2001 IEEE international symposium on semiconductor manufacturing (ISSM 2001) : October 8-10, 2001, San Jose, California

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

ER -

Capacity calculation of an AGV system in a MP2 wafer fab by means of simulation

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