Broadband CMOS millimeter-wave frequency multiplier with Vivaldi antenna in 3D chip-scale packaging

L. Tripodi; Xin Hu; R. Götzen; M. Matters - Kammerer; D. Goor, van; Shi Cheng; A. Rydberg

doi:10.1109/TMTT.2012.2220564

Broadband CMOS millimeter-wave frequency multiplier with Vivaldi antenna in 3D chip-scale packaging

L. Tripodi
, Xin Hu
, R. Götzen
, M. Matters - Kammerer
, D. Goor, van
, Shi Cheng
, A. Rydberg

Research output: Contribution to journal › Article › Academic › peer-review

15 Citations (Scopus)

8 Downloads (Pure)

Abstract

This paper describes a frequency multiplier able to emit a broadband signal with a frequency range from 70 GHz up to at least 170 GHz. The device is composed of a nonlinear transmission line implemented in commercial CMOS 65-nm technology and an off-chip Vivaldi antenna. These two elements are packaged together in a 3D chip-scale packaging technology. Characterization of the whole device and of the standalone nonlinear transmission line is presented at frequencies up to 170 GHz.

Original language	English
Pages (from-to)	3761-3768
Number of pages	8
Journal	IEEE Transactions on Microwave Theory and Techniques
Volume	60
Issue number	12
DOIs	https://doi.org/10.1109/TMTT.2012.2220564
Publication status	Published - 2012

Access to Document

10.1109/TMTT.2012.2220564

Cite this

@article{b472d57111eb4df2920c184c4abb4228,

title = "Broadband CMOS millimeter-wave frequency multiplier with Vivaldi antenna in 3D chip-scale packaging",

abstract = "This paper describes a frequency multiplier able to emit a broadband signal with a frequency range from 70 GHz up to at least 170 GHz. The device is composed of a nonlinear transmission line implemented in commercial CMOS 65-nm technology and an off-chip Vivaldi antenna. These two elements are packaged together in a 3D chip-scale packaging technology. Characterization of the whole device and of the standalone nonlinear transmission line is presented at frequencies up to 170 GHz.",

author = "L. Tripodi and Xin Hu and R. G{\"o}tzen and \{Matters - Kammerer\}, M. and \{Goor, van\}, D. and Shi Cheng and A. Rydberg",

year = "2012",

doi = "10.1109/TMTT.2012.2220564",

language = "English",

volume = "60",

pages = "3761--3768",

journal = "IEEE Transactions on Microwave Theory and Techniques",

issn = "0018-9480",

publisher = "Institute of Electrical and Electronics Engineers",

number = "12",

}

TY - JOUR

T1 - Broadband CMOS millimeter-wave frequency multiplier with Vivaldi antenna in 3D chip-scale packaging

AU - Tripodi, L.

AU - Hu, Xin

AU - Götzen, R.

AU - Matters - Kammerer, M.

AU - Goor, van, D.

AU - Cheng, Shi

AU - Rydberg, A.

PY - 2012

Y1 - 2012

N2 - This paper describes a frequency multiplier able to emit a broadband signal with a frequency range from 70 GHz up to at least 170 GHz. The device is composed of a nonlinear transmission line implemented in commercial CMOS 65-nm technology and an off-chip Vivaldi antenna. These two elements are packaged together in a 3D chip-scale packaging technology. Characterization of the whole device and of the standalone nonlinear transmission line is presented at frequencies up to 170 GHz.

AB - This paper describes a frequency multiplier able to emit a broadband signal with a frequency range from 70 GHz up to at least 170 GHz. The device is composed of a nonlinear transmission line implemented in commercial CMOS 65-nm technology and an off-chip Vivaldi antenna. These two elements are packaged together in a 3D chip-scale packaging technology. Characterization of the whole device and of the standalone nonlinear transmission line is presented at frequencies up to 170 GHz.

U2 - 10.1109/TMTT.2012.2220564

DO - 10.1109/TMTT.2012.2220564

M3 - Article

SN - 0018-9480

VL - 60

SP - 3761

EP - 3768

JO - IEEE Transactions on Microwave Theory and Techniques

JF - IEEE Transactions on Microwave Theory and Techniques

IS - 12

ER -

Broadband CMOS millimeter-wave frequency multiplier with Vivaldi antenna in 3D chip-scale packaging

Abstract

Access to Document

Fingerprint

Cite this