Bondwire impedance compensation using a series transmission line section

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Bondwires at millimeter-wave frequencies show a high impedance mismatch that limits their applications in signal transmission from chip-to-chip, chip-to-package or vice-versa. Using a series transmission-line section and embedding the bondwire and the compensating circuit in an epoxy, we improved the matching and reduced the insertion loss. Furthermore, by changing the length of the compensating transmission line and the wire length, the technique can be used over a bandwidth of more than 10 GHz at mm-waves. The measured results for a wire length of 0.7 mm with the matching section a 0.425 mm show an impedance matching with S11 below -6 dB and a simulated insertion loss of 0.35 dB over a 10 GHz bandwidth.

Original languageEnglish
Title of host publication2016 10th European Conference on Antennas and Propagation, EuCAP 2016, 10-15 April 2016, Davos, Switzerland
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
ISBN (Electronic)9788890701863
Publication statusPublished - 31 May 2016
Event10th European Conference on Antennas and Propagation (EuCAP 2016) - Davos, Switzerland
Duration: 10 Apr 201615 Apr 2016
Conference number: 10


Conference10th European Conference on Antennas and Propagation (EuCAP 2016)
Abbreviated titleEuCAP 2016
Internet address


  • bondwire interconnects
  • impedance compensation
  • insertion loss
  • millimeter waves


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