Bondwire impedance compensation using a series transmission line section

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)

Abstract

Bondwires at millimeter-wave frequencies show a high impedance mismatch that limits their applications in signal transmission from chip-to-chip, chip-to-package or vice-versa. Using a series transmission-line section and embedding the bondwire and the compensating circuit in an epoxy, we improved the matching and reduced the insertion loss. Furthermore, by changing the length of the compensating transmission line and the wire length, the technique can be used over a bandwidth of more than 10 GHz at mm-waves. The measured results for a wire length of 0.7 mm with the matching section a 0.425 mm show an impedance matching with S11 below -6 dB and a simulated insertion loss of 0.35 dB over a 10 GHz bandwidth.

LanguageEnglish
Title of host publication2016 10th European Conference on Antennas and Propagation, EuCAP 2016, 10-15 April 2016, Davos, Switzerland
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages1-4
ISBN (Electronic)9788890701863
DOIs
StatePublished - 31 May 2016
Event10th European Conference on Antennas and Propagation (EuCAP 2016) - Davos, Switzerland
Duration: 10 Apr 201615 Apr 2016
Conference number: 10
http://www.eucap.org/

Conference

Conference10th European Conference on Antennas and Propagation (EuCAP 2016)
Abbreviated titleEuCAP 2016
CountrySwitzerland
CityDavos
Period10/04/1615/04/16
Internet address

Fingerprint

Insertion losses
transmission lines
Electric lines
chips
impedance
Wire
Bandwidth
insertion loss
Millimeter waves
wire
bandwidth
signal transmission
impedance matching
embedding
millimeter waves
Networks (circuits)
Compensation and Redress

Keywords

  • bondwire interconnects
  • impedance compensation
  • insertion loss
  • millimeter waves

Cite this

Adela, B. B., van Zeijl, P., & Smolders, A. B. (2016). Bondwire impedance compensation using a series transmission line section. In 2016 10th European Conference on Antennas and Propagation, EuCAP 2016, 10-15 April 2016, Davos, Switzerland (pp. 1-4). [7481607] Piscataway: Institute of Electrical and Electronics Engineers. DOI: 10.1109/EuCAP.2016.7481607
Adela, B.B. ; van Zeijl, Paul ; Smolders, A.B./ Bondwire impedance compensation using a series transmission line section. 2016 10th European Conference on Antennas and Propagation, EuCAP 2016, 10-15 April 2016, Davos, Switzerland . Piscataway : Institute of Electrical and Electronics Engineers, 2016. pp. 1-4
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abstract = "Bondwires at millimeter-wave frequencies show a high impedance mismatch that limits their applications in signal transmission from chip-to-chip, chip-to-package or vice-versa. Using a series transmission-line section and embedding the bondwire and the compensating circuit in an epoxy, we improved the matching and reduced the insertion loss. Furthermore, by changing the length of the compensating transmission line and the wire length, the technique can be used over a bandwidth of more than 10 GHz at mm-waves. The measured results for a wire length of 0.7 mm with the matching section a 0.425 mm show an impedance matching with S11 below -6 dB and a simulated insertion loss of 0.35 dB over a 10 GHz bandwidth.",
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Adela, BB, van Zeijl, P & Smolders, AB 2016, Bondwire impedance compensation using a series transmission line section. in 2016 10th European Conference on Antennas and Propagation, EuCAP 2016, 10-15 April 2016, Davos, Switzerland ., 7481607, Institute of Electrical and Electronics Engineers, Piscataway, pp. 1-4, 10th European Conference on Antennas and Propagation (EuCAP 2016), Davos, Switzerland, 10/04/16. DOI: 10.1109/EuCAP.2016.7481607

Bondwire impedance compensation using a series transmission line section. / Adela, B.B.; van Zeijl, Paul; Smolders, A.B.

2016 10th European Conference on Antennas and Propagation, EuCAP 2016, 10-15 April 2016, Davos, Switzerland . Piscataway : Institute of Electrical and Electronics Engineers, 2016. p. 1-4 7481607.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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AB - Bondwires at millimeter-wave frequencies show a high impedance mismatch that limits their applications in signal transmission from chip-to-chip, chip-to-package or vice-versa. Using a series transmission-line section and embedding the bondwire and the compensating circuit in an epoxy, we improved the matching and reduced the insertion loss. Furthermore, by changing the length of the compensating transmission line and the wire length, the technique can be used over a bandwidth of more than 10 GHz at mm-waves. The measured results for a wire length of 0.7 mm with the matching section a 0.425 mm show an impedance matching with S11 below -6 dB and a simulated insertion loss of 0.35 dB over a 10 GHz bandwidth.

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Adela BB, van Zeijl P, Smolders AB. Bondwire impedance compensation using a series transmission line section. In 2016 10th European Conference on Antennas and Propagation, EuCAP 2016, 10-15 April 2016, Davos, Switzerland . Piscataway: Institute of Electrical and Electronics Engineers. 2016. p. 1-4. 7481607. Available from, DOI: 10.1109/EuCAP.2016.7481607