Abstract
Bondwires at millimeter-wave frequencies show a high impedance mismatch that limits their applications in signal transmission from chip-to-chip, chip-to-package or vice-versa. Using a series transmission-line section and embedding the bondwire and the compensating circuit in an epoxy, we improved the matching and reduced the insertion loss. Furthermore, by changing the length of the compensating transmission line and the wire length, the technique can be used over a bandwidth of more than 10 GHz at mm-waves. The measured results for a wire length of 0.7 mm with the matching section a 0.425 mm show an impedance matching with S11 below -6 dB and a simulated insertion loss of 0.35 dB over a 10 GHz bandwidth.
| Original language | English |
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| Title of host publication | 2016 10th European Conference on Antennas and Propagation, EuCAP 2016, 10-15 April 2016, Davos, Switzerland |
| Place of Publication | Piscataway |
| Publisher | Institute of Electrical and Electronics Engineers |
| Pages | 1-4 |
| ISBN (Electronic) | 9788890701863 |
| DOIs | |
| Publication status | Published - 31 May 2016 |
| Event | 10th European Conference on Antennas and Propagation (EuCAP 2016) - Davos, Switzerland Duration: 10 Apr 2016 → 15 Apr 2016 Conference number: 10 http://www.eucap.org/ |
Conference
| Conference | 10th European Conference on Antennas and Propagation (EuCAP 2016) |
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| Abbreviated title | EuCAP 2016 |
| Country/Territory | Switzerland |
| City | Davos |
| Period | 10/04/16 → 15/04/16 |
| Internet address |
Keywords
- bondwire interconnects
- impedance compensation
- insertion loss
- millimeter waves