Bondwire impedance compensation using a series transmission line section

B.B. Adela; Paul van Zeijl; A.B. Smolders

doi:10.1109/EuCAP.2016.7481607

Bondwire impedance compensation using a series transmission line section

B.B. Adela, Paul van Zeijl, A.B. Smolders

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

1 Citation (Scopus)

2 Downloads (Pure)

Abstract

Bondwires at millimeter-wave frequencies show a high impedance mismatch that limits their applications in signal transmission from chip-to-chip, chip-to-package or vice-versa. Using a series transmission-line section and embedding the bondwire and the compensating circuit in an epoxy, we improved the matching and reduced the insertion loss. Furthermore, by changing the length of the compensating transmission line and the wire length, the technique can be used over a bandwidth of more than 10 GHz at mm-waves. The measured results for a wire length of 0.7 mm with the matching section a 0.425 mm show an impedance matching with S11 below -6 dB and a simulated insertion loss of 0.35 dB over a 10 GHz bandwidth.

Original language	English
Title of host publication	2016 10th European Conference on Antennas and Propagation, EuCAP 2016, 10-15 April 2016, Davos, Switzerland
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	1-4
ISBN (Electronic)	9788890701863
DOIs	https://doi.org/10.1109/EuCAP.2016.7481607
Publication status	Published - 31 May 2016
Event	10th European Conference on Antennas and Propagation (EuCAP 2016) - Davos, Switzerland Duration: 10 Apr 2016 → 15 Apr 2016 Conference number: 10 http://www.eucap.org/

Conference

Conference	10th European Conference on Antennas and Propagation (EuCAP 2016)
Abbreviated title	EuCAP 2016
Country	Switzerland
City	Davos
Period	10/04/16 → 15/04/16
Internet address	http://www.eucap.org/

Keywords

bondwire interconnects
impedance compensation
insertion loss
millimeter waves

Access to Document

10.1109/EuCAP.2016.7481607

Link to publication in Scopus

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Adela, B. B., van Zeijl, P., & Smolders, A. B. (2016). Bondwire impedance compensation using a series transmission line section. In 2016 10th European Conference on Antennas and Propagation, EuCAP 2016, 10-15 April 2016, Davos, Switzerland (pp. 1-4). [7481607] Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuCAP.2016.7481607

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abstract = "Bondwires at millimeter-wave frequencies show a high impedance mismatch that limits their applications in signal transmission from chip-to-chip, chip-to-package or vice-versa. Using a series transmission-line section and embedding the bondwire and the compensating circuit in an epoxy, we improved the matching and reduced the insertion loss. Furthermore, by changing the length of the compensating transmission line and the wire length, the technique can be used over a bandwidth of more than 10 GHz at mm-waves. The measured results for a wire length of 0.7 mm with the matching section a 0.425 mm show an impedance matching with S11 below -6 dB and a simulated insertion loss of 0.35 dB over a 10 GHz bandwidth.",

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Adela, BB, van Zeijl, P & Smolders, AB 2016, Bondwire impedance compensation using a series transmission line section. in 2016 10th European Conference on Antennas and Propagation, EuCAP 2016, 10-15 April 2016, Davos, Switzerland ., 7481607, Institute of Electrical and Electronics Engineers, Piscataway, pp. 1-4, 10th European Conference on Antennas and Propagation (EuCAP 2016), Davos, Switzerland, 10/04/16. https://doi.org/10.1109/EuCAP.2016.7481607

Bondwire impedance compensation using a series transmission line section. / Adela, B.B.; van Zeijl, Paul ; Smolders, A.B.

2016 10th European Conference on Antennas and Propagation, EuCAP 2016, 10-15 April 2016, Davos, Switzerland . Piscataway : Institute of Electrical and Electronics Engineers, 2016. p. 1-4 7481607.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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