Bonding-wire triangular spiral inductor for on-chip switching power converters

G. Villar; J. Delos Ayllon; E. Alarcon

doi:10.1109/ISCAS.2011.5937691

Bonding-wire triangular spiral inductor for on-chip switching power converters

G. Villar, J. Delos Ayllon, E. Alarcon

Electromechanics and Power Electronics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

4 Citations (Scopus)

Abstract

This work presents the first design and modelling of bonding-wire-based triangular spiral inductors (Fig. 1), targeting their application to on-chip switching power converters. It is demonstrated that the equilateral triangular shape compared to other polygonal shapes best balances the inductive density as well as the total Equivalent Series Resistance (ESR). Afterwards, a design procedure is presented in order to optimize the inductor design, in terms of ESR and occupied area reduction. Finally, finite-elements simulation results of an optimized design (27 nH, 1 O) are presented to validate the proposed expressions.

Original language	English
Title of host publication	Proceedings of the 2011 IEEE International Symposium on Circuits and Systems (ISCAS), 15-18 May 2011, Rio De Janeiro, RJ, Brazil
Pages	817-820
DOIs	https://doi.org/10.1109/ISCAS.2011.5937691
Publication status	Published - 2011

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10.1109/ISCAS.2011.5937691

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title = "Bonding-wire triangular spiral inductor for on-chip switching power converters",

abstract = "This work presents the first design and modelling of bonding-wire-based triangular spiral inductors (Fig. 1), targeting their application to on-chip switching power converters. It is demonstrated that the equilateral triangular shape compared to other polygonal shapes best balances the inductive density as well as the total Equivalent Series Resistance (ESR). Afterwards, a design procedure is presented in order to optimize the inductor design, in terms of ESR and occupied area reduction. Finally, finite-elements simulation results of an optimized design (27 nH, 1 O) are presented to validate the proposed expressions.",

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doi = "10.1109/ISCAS.2011.5937691",

language = "English",

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Bonding-wire triangular spiral inductor for on-chip switching power converters. / Villar, G.; Delos Ayllon, J.; Alarcon, E.
Proceedings of the 2011 IEEE International Symposium on Circuits and Systems (ISCAS), 15-18 May 2011, Rio De Janeiro, RJ, Brazil. 2011. p. 817-820.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Bonding-wire triangular spiral inductor for on-chip switching power converters

AU - Villar, G.

AU - Delos Ayllon, J.

AU - Alarcon, E.

PY - 2011

Y1 - 2011

N2 - This work presents the first design and modelling of bonding-wire-based triangular spiral inductors (Fig. 1), targeting their application to on-chip switching power converters. It is demonstrated that the equilateral triangular shape compared to other polygonal shapes best balances the inductive density as well as the total Equivalent Series Resistance (ESR). Afterwards, a design procedure is presented in order to optimize the inductor design, in terms of ESR and occupied area reduction. Finally, finite-elements simulation results of an optimized design (27 nH, 1 O) are presented to validate the proposed expressions.

AB - This work presents the first design and modelling of bonding-wire-based triangular spiral inductors (Fig. 1), targeting their application to on-chip switching power converters. It is demonstrated that the equilateral triangular shape compared to other polygonal shapes best balances the inductive density as well as the total Equivalent Series Resistance (ESR). Afterwards, a design procedure is presented in order to optimize the inductor design, in terms of ESR and occupied area reduction. Finally, finite-elements simulation results of an optimized design (27 nH, 1 O) are presented to validate the proposed expressions.

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DO - 10.1109/ISCAS.2011.5937691

M3 - Conference contribution

SN - 978-1-4244-9474-1

SP - 817

EP - 820

BT - Proceedings of the 2011 IEEE International Symposium on Circuits and Systems (ISCAS), 15-18 May 2011, Rio De Janeiro, RJ, Brazil

ER -

Bonding-wire triangular spiral inductor for on-chip switching power converters

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