Bonding copper and aluminium nitride : which process is suitable?

R.N.H. Moes, Technische Universiteit Eindhoven (TUE). Stan Ackermans Instituut. Proces- en Produktontwerp

Research output: Thesis › EngD Thesis

Original language	English
Qualification	Doctor of Philosophy
Awarding Institution
Supervisors/Advisors	van Loo, F.J.J., Supervisor Metselaar, Ruud, Supervisor Kodentsov, Sasha, Supervisor Vijgen, R.O.E., Supervisor Maury, F., External supervisor, External person
Award date	1 Jan 1994
Place of Publication	Eindhoven
Publisher	Technische Universiteit Eindhoven
Print ISBNs	90-5282-410-X
Publication status	Published - 1994

Eindverslag

Cite this

@phdthesis{5e02bb8426c7469eaefe39286ec56b7f,

title = "Bonding copper and aluminium nitride : which process is suitable?",

author = "R.N.H. Moes and \{Technische Universiteit Eindhoven (TUE). Stan Ackermans Instituut. Proces- en Produktontwerp\}",

note = "Eindverslag",

year = "1994",

language = "English",

isbn = "90-5282-410-X",

publisher = "Technische Universiteit Eindhoven",

type = "EngD Thesis",

}