BIST method for die-level process parameter variation monitoring in analog/mixed-signal integrated circuits

A. Zjajo; M.J. Barragan Asian; J. Pineda de Gyvez

doi:10.1109/DATE.2007.364477

BIST method for die-level process parameter variation monitoring in analog/mixed-signal integrated circuits

A. Zjajo, M.J. Barragan Asian, J. Pineda de Gyvez

Electronic Systems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

22 Citations (Scopus)

134 Downloads (Pure)

Abstract

This paper reports a new built-in self-test scheme for analog and mixed-signal devices based on die-level process monitoring. The objective of this test is not to replace traditional specification-based tests, but to provide a reliable method for early identification of excessive process parameter variations in production tests that allows quickly discarding of the faulty circuits. Additionally, the possibility of on-chip process deviation monitoring provides valuable information, which is used to guide the test and to allow the estimation of selected performance figures. The information obtained through guiding and monitoring process variations is re-used and supplement the circuit calibration

Original language	English
Title of host publication	Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2007, DATE '07, 16-20 April 2007, Nice Acropolis, France
Place of Publication	New York
Publisher	Institute of Electrical and Electronics Engineers
Pages	1-6
ISBN (Print)	978-3-9810801-2-4
DOIs	https://doi.org/10.1109/DATE.2007.364477
Publication status	Published - 2007

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Zjajo, A., Barragan Asian, M. J., & Pineda de Gyvez, J. (2007). BIST method for die-level process parameter variation monitoring in analog/mixed-signal integrated circuits. In Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2007, DATE '07, 16-20 April 2007, Nice Acropolis, France (pp. 1-6). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/DATE.2007.364477

Zjajo, A. ; Barragan Asian, M.J. ; Pineda de Gyvez, J. / BIST method for die-level process parameter variation monitoring in analog/mixed-signal integrated circuits. Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2007, DATE '07, 16-20 April 2007, Nice Acropolis, France. New York : Institute of Electrical and Electronics Engineers, 2007. pp. 1-6

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title = "BIST method for die-level process parameter variation monitoring in analog/mixed-signal integrated circuits",

abstract = "This paper reports a new built-in self-test scheme for analog and mixed-signal devices based on die-level process monitoring. The objective of this test is not to replace traditional specification-based tests, but to provide a reliable method for early identification of excessive process parameter variations in production tests that allows quickly discarding of the faulty circuits. Additionally, the possibility of on-chip process deviation monitoring provides valuable information, which is used to guide the test and to allow the estimation of selected performance figures. The information obtained through guiding and monitoring process variations is re-used and supplement the circuit calibration",

author = "A. Zjajo and {Barragan Asian}, M.J. and {Pineda de Gyvez}, J.",

year = "2007",

doi = "10.1109/DATE.2007.364477",

language = "English",

isbn = "978-3-9810801-2-4",

pages = "1--6",

booktitle = "Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2007, DATE '07, 16-20 April 2007, Nice Acropolis, France",

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Zjajo, A, Barragan Asian, MJ & Pineda de Gyvez, J 2007, BIST method for die-level process parameter variation monitoring in analog/mixed-signal integrated circuits. in Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2007, DATE '07, 16-20 April 2007, Nice Acropolis, France. Institute of Electrical and Electronics Engineers, New York, pp. 1-6. https://doi.org/10.1109/DATE.2007.364477

BIST method for die-level process parameter variation monitoring in analog/mixed-signal integrated circuits. / Zjajo, A.; Barragan Asian, M.J.; Pineda de Gyvez, J.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2007, DATE '07, 16-20 April 2007, Nice Acropolis, France. New York: Institute of Electrical and Electronics Engineers, 2007. p. 1-6.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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N2 - This paper reports a new built-in self-test scheme for analog and mixed-signal devices based on die-level process monitoring. The objective of this test is not to replace traditional specification-based tests, but to provide a reliable method for early identification of excessive process parameter variations in production tests that allows quickly discarding of the faulty circuits. Additionally, the possibility of on-chip process deviation monitoring provides valuable information, which is used to guide the test and to allow the estimation of selected performance figures. The information obtained through guiding and monitoring process variations is re-used and supplement the circuit calibration

AB - This paper reports a new built-in self-test scheme for analog and mixed-signal devices based on die-level process monitoring. The objective of this test is not to replace traditional specification-based tests, but to provide a reliable method for early identification of excessive process parameter variations in production tests that allows quickly discarding of the faulty circuits. Additionally, the possibility of on-chip process deviation monitoring provides valuable information, which is used to guide the test and to allow the estimation of selected performance figures. The information obtained through guiding and monitoring process variations is re-used and supplement the circuit calibration

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M3 - Conference contribution

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BT - Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2007, DATE '07, 16-20 April 2007, Nice Acropolis, France

PB - Institute of Electrical and Electronics Engineers

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Zjajo A, Barragan Asian MJ, Pineda de Gyvez J. BIST method for die-level process parameter variation monitoring in analog/mixed-signal integrated circuits. In Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2007, DATE '07, 16-20 April 2007, Nice Acropolis, France. New York: Institute of Electrical and Electronics Engineers. 2007. p. 1-6 doi: 10.1109/DATE.2007.364477

BIST method for die-level process parameter variation monitoring in analog/mixed-signal integrated circuits

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