Abstract
In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained.
| Original language | English |
|---|---|
| Title of host publication | Proceedings Symposium IEEE Photonics Society Benelux, 2018, Brussels, Belgium |
| Pages | 160-163 |
| Number of pages | 4 |
| Publication status | Published - Nov 2018 |
| Event | IEEE Photonics Benelux Chapter Annual Symposium 2018 - Paleis der Academiën, Brussels, Belgium Duration: 15 Nov 2018 → 16 Nov 2018 |
Conference
| Conference | IEEE Photonics Benelux Chapter Annual Symposium 2018 |
|---|---|
| Country | Belgium |
| City | Brussels |
| Period | 15/11/18 → 16/11/18 |
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Cite this
Spiegelberg, M., van Engelen, J., de Vries, T., Williams, K., & van der Tol, J. (2018). BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers. In Proceedings Symposium IEEE Photonics Society Benelux, 2018, Brussels, Belgium (pp. 160-163)