BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers

Marc Spiegelberg, Jorn van Engelen, Tjibbe de Vries, Kevin Williams, Jos van der Tol

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

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Abstract

In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained.
Original languageEnglish
Title of host publicationProceedings Symposium IEEE Photonics Society Benelux, 2018, Brussels, Belgium
Pages160-163
Number of pages4
Publication statusPublished - Nov 2018
Event23rd Annual Symposium of the IEEE Photonics Society Benelux - Paleis der Academiën, Brussels, Belgium
Duration: 15 Nov 201816 Nov 2018
Conference number: 23

Conference

Conference23rd Annual Symposium of the IEEE Photonics Society Benelux
Country/TerritoryBelgium
CityBrussels
Period15/11/1816/11/18

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