BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers

Marc Spiegelberg; Jorn van Engelen; Tjibbe de Vries; Kevin Williams; Jos van der Tol

BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers

Marc Spiegelberg, Jorn van Engelen, Tjibbe de Vries, Kevin Williams, Jos van der Tol

Photonic Integration

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

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Abstract

In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained.

Original language	English
Title of host publication	Proceedings Symposium IEEE Photonics Society Benelux, 2018, Brussels, Belgium
Pages	160-163
Number of pages	4
Publication status	Published - Nov 2018
Event	IEEE Photonics Benelux Chapter Annual Symposium 2018 - Paleis der Academiën, Brussels, Belgium Duration: 15 Nov 2018 → 16 Nov 2018

Conference

Conference	IEEE Photonics Benelux Chapter Annual Symposium 2018
Country	Belgium
City	Brussels
Period	15/11/18 → 16/11/18

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Cite this

@inproceedings{b2b75568e44e4b7cb9064a643a55d41a,

title = "BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers",

abstract = "In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained.",

author = "Marc Spiegelberg and {van Engelen}, Jorn and {de Vries}, Tjibbe and Kevin Williams and {van der Tol}, Jos",

year = "2018",

month = nov,

language = "English",

pages = "160--163",

booktitle = "Proceedings Symposium IEEE Photonics Society Benelux, 2018, Brussels, Belgium",

note = "IEEE Photonics Benelux Chapter Annual Symposium 2018 ; Conference date: 15-11-2018 Through 16-11-2018",

}

BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers. / Spiegelberg, Marc ; van Engelen, Jorn; de Vries, Tjibbe; Williams, Kevin ; van der Tol, Jos.

Proceedings Symposium IEEE Photonics Society Benelux, 2018, Brussels, Belgium. 2018. p. 160-163.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

TY - GEN

T1 - BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers

AU - Spiegelberg, Marc

AU - van Engelen, Jorn

AU - de Vries, Tjibbe

AU - Williams, Kevin

AU - van der Tol, Jos

PY - 2018/11

Y1 - 2018/11

N2 - In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained.

AB - In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained.

M3 - Conference contribution

SP - 160

EP - 163

BT - Proceedings Symposium IEEE Photonics Society Benelux, 2018, Brussels, Belgium

T2 - IEEE Photonics Benelux Chapter Annual Symposium 2018

Y2 - 15 November 2018 through 16 November 2018

ER -