BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers

Marc Spiegelberg; Jorn van Engelen; Tjibbe de Vries; Kevin Williams; Jos van der Tol

BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers

Marc Spiegelberg, Jorn van Engelen, Tjibbe de Vries, Kevin Williams, Jos van der Tol

Photonic Integration

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

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Abstract

In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained.

Original language	English
Title of host publication	Proceedings Symposium IEEE Photonics Society Benelux, 2018, Brussels, Belgium
Pages	160-163
Number of pages	4
Publication status	Published - Nov 2018
Event	23rd Annual Symposium of the IEEE Photonics Society Benelux - Paleis der Academiën, Brussels, Belgium Duration: 15 Nov 2018 → 16 Nov 2018 Conference number: 23

Conference

Conference	23rd Annual Symposium of the IEEE Photonics Society Benelux
Country/Territory	Belgium
City	Brussels
Period	15/11/18 → 16/11/18

Cite this

@inproceedings{b2b75568e44e4b7cb9064a643a55d41a,

title = "BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers",

abstract = "In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained.",

author = "Marc Spiegelberg and {van Engelen}, Jorn and {de Vries}, Tjibbe and Kevin Williams and {van der Tol}, Jos",

year = "2018",

month = nov,

language = "English",

pages = "160--163",

booktitle = "Proceedings Symposium IEEE Photonics Society Benelux, 2018, Brussels, Belgium",

note = "23rd Annual Symposium of the IEEE Photonics Society Benelux ; Conference date: 15-11-2018 Through 16-11-2018",

}

TY - GEN

T1 - BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers

AU - Spiegelberg, Marc

AU - van Engelen, Jorn

AU - de Vries, Tjibbe

AU - Williams, Kevin

AU - van der Tol, Jos

N1 - Conference code: 23

PY - 2018/11

Y1 - 2018/11

N2 - In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained.

AB - In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained.

M3 - Conference contribution

SP - 160

EP - 163

BT - Proceedings Symposium IEEE Photonics Society Benelux, 2018, Brussels, Belgium

T2 - 23rd Annual Symposium of the IEEE Photonics Society Benelux

Y2 - 15 November 2018 through 16 November 2018

ER -

BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers

Abstract

Conference

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