Abstract
In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained.
Original language | English |
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Title of host publication | Proceedings Symposium IEEE Photonics Society Benelux, 2018, Brussels, Belgium |
Pages | 160-163 |
Number of pages | 4 |
Publication status | Published - Nov 2018 |
Event | 23rd Annual Symposium of the IEEE Photonics Society Benelux - Paleis der Academiën, Brussels, Belgium Duration: 15 Nov 2018 → 16 Nov 2018 Conference number: 23 |
Conference
Conference | 23rd Annual Symposium of the IEEE Photonics Society Benelux |
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Country/Territory | Belgium |
City | Brussels |
Period | 15/11/18 → 16/11/18 |