BAW devices and integration into system-in-package (SIP)

A.B. Smolders, J.W. Lobeek, N.J. Pulsford, F.E. van Straten

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Original languageEnglish
Title of host publicationProceedings of the 3rd International Symposium on Acoustic Wave Devices for Future Mobile Communiction Systems, 6-8 March 2007, Chiba, Japan
Pages105-110
Publication statusPublished - 2007
Eventconference; 3rd International Symposium on Acoustic Wave Devices for Future Mobile Communication Systems, Chiba, Japan; 2007-03-06; 2007-03-08 -
Duration: 6 Mar 20078 Mar 2007

Conference

Conferenceconference; 3rd International Symposium on Acoustic Wave Devices for Future Mobile Communication Systems, Chiba, Japan; 2007-03-06; 2007-03-08
Period6/03/078/03/07
Other3rd International Symposium on Acoustic Wave Devices for Future Mobile Communication Systems, Chiba, Japan

Cite this

Smolders, A. B., Lobeek, J. W., Pulsford, N. J., & van Straten, F. E. (2007). BAW devices and integration into system-in-package (SIP). In Proceedings of the 3rd International Symposium on Acoustic Wave Devices for Future Mobile Communiction Systems, 6-8 March 2007, Chiba, Japan (pp. 105-110)