Automatic generation of in-circuit tests for board assembly defects

Harm van Schaaijk; Martien Spierings; Erik Jan Marinissen

doi:10.1109/ITC-Asia.2018.00013

Automatic generation of in-circuit tests for board assembly defects

Harm van Schaaijk, Martien Spierings, Erik Jan Marinissen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

5 Citations (Scopus)

205 Downloads (Pure)

Abstract

The components and the solder joints that are made during assembly to hold components to their printed circuit board can suffer from defects and therefore need to be tested. Many research papers on board-assembly testing focus on boundary scan test, processor-controlled test, or other powered digital testing techniques that mostly ignore the indispensable passive circuits and that can incur damage that could have been avoided by executing a non-powered test first. In-circuit testing is a non-powered test method that applies' stimuli and measures responses using probe needles. However, often used self-learning solutions for designing these tests need a known-good-board, entailing significant disadvantages. In this paper, a software tool is described that automatically generates in-circuit tests based on the product design files, without requiring probe access on every net. Furthermore, the tool indicates where on the board fault coverage is not maximal, and hence where extra probe access will improve the test quality.

Original language	English
Title of host publication	Proceedings - 2nd IEEE International Test Conference in Asia, ITC-Asia 2018
Publisher	Institute of Electrical and Electronics Engineers
Pages	13-18
Number of pages	6
ISBN (Print)	9781538651803
DOIs	https://doi.org/10.1109/ITC-Asia.2018.00013
Publication status	Published - 15 Aug 2018
Event	2nd IEEE International Test Conference in Asia, ITC-Asia 2018 - Harbin, China Duration: 15 Aug 2018 → 17 Aug 2018

Conference

Conference	2nd IEEE International Test Conference in Asia, ITC-Asia 2018
Country/Territory	China
City	Harbin
Period	15/08/18 → 17/08/18

Keywords

Automatic Test Generation
DFT
ICT
In Circuit Test

Access to Document

10.1109/ITC-Asia.2018.00013

itcasia18-authorpreprintFinal author version , 619 KB

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title = "Automatic generation of in-circuit tests for board assembly defects",

abstract = "The components and the solder joints that are made during assembly to hold components to their printed circuit board can suffer from defects and therefore need to be tested. Many research papers on board-assembly testing focus on boundary scan test, processor-controlled test, or other powered digital testing techniques that mostly ignore the indispensable passive circuits and that can incur damage that could have been avoided by executing a non-powered test first. In-circuit testing is a non-powered test method that applies' stimuli and measures responses using probe needles. However, often used self-learning solutions for designing these tests need a known-good-board, entailing significant disadvantages. In this paper, a software tool is described that automatically generates in-circuit tests based on the product design files, without requiring probe access on every net. Furthermore, the tool indicates where on the board fault coverage is not maximal, and hence where extra probe access will improve the test quality.",

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author = "{van Schaaijk}, Harm and Martien Spierings and Marinissen, {Erik Jan}",

year = "2018",

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language = "English",

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booktitle = "Proceedings - 2nd IEEE International Test Conference in Asia, ITC-Asia 2018",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "2nd IEEE International Test Conference in Asia, ITC-Asia 2018 ; Conference date: 15-08-2018 Through 17-08-2018",

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van Schaaijk, H, Spierings, M & Marinissen, EJ 2018, Automatic generation of in-circuit tests for board assembly defects. in Proceedings - 2nd IEEE International Test Conference in Asia, ITC-Asia 2018., 8462941, Institute of Electrical and Electronics Engineers, pp. 13-18, 2nd IEEE International Test Conference in Asia, ITC-Asia 2018, Harbin, China, 15/08/18. https://doi.org/10.1109/ITC-Asia.2018.00013

Automatic generation of in-circuit tests for board assembly defects. / van Schaaijk, Harm; Spierings, Martien; Marinissen, Erik Jan.
Proceedings - 2nd IEEE International Test Conference in Asia, ITC-Asia 2018. Institute of Electrical and Electronics Engineers, 2018. p. 13-18 8462941.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - Spierings, Martien

AU - Marinissen, Erik Jan

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N2 - The components and the solder joints that are made during assembly to hold components to their printed circuit board can suffer from defects and therefore need to be tested. Many research papers on board-assembly testing focus on boundary scan test, processor-controlled test, or other powered digital testing techniques that mostly ignore the indispensable passive circuits and that can incur damage that could have been avoided by executing a non-powered test first. In-circuit testing is a non-powered test method that applies' stimuli and measures responses using probe needles. However, often used self-learning solutions for designing these tests need a known-good-board, entailing significant disadvantages. In this paper, a software tool is described that automatically generates in-circuit tests based on the product design files, without requiring probe access on every net. Furthermore, the tool indicates where on the board fault coverage is not maximal, and hence where extra probe access will improve the test quality.

AB - The components and the solder joints that are made during assembly to hold components to their printed circuit board can suffer from defects and therefore need to be tested. Many research papers on board-assembly testing focus on boundary scan test, processor-controlled test, or other powered digital testing techniques that mostly ignore the indispensable passive circuits and that can incur damage that could have been avoided by executing a non-powered test first. In-circuit testing is a non-powered test method that applies' stimuli and measures responses using probe needles. However, often used self-learning solutions for designing these tests need a known-good-board, entailing significant disadvantages. In this paper, a software tool is described that automatically generates in-circuit tests based on the product design files, without requiring probe access on every net. Furthermore, the tool indicates where on the board fault coverage is not maximal, and hence where extra probe access will improve the test quality.

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Automatic generation of in-circuit tests for board assembly defects

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