Automatic generation of in-circuit tests for board assembly defects

Harm van Schaaijk, Martien Spierings, Erik Jan Marinissen

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

4 Citations (Scopus)
175 Downloads (Pure)

Abstract

The components and the solder joints that are made during assembly to hold components to their printed circuit board can suffer from defects and therefore need to be tested. Many research papers on board-assembly testing focus on boundary scan test, processor-controlled test, or other powered digital testing techniques that mostly ignore the indispensable passive circuits and that can incur damage that could have been avoided by executing a non-powered test first. In-circuit testing is a non-powered test method that applies' stimuli and measures responses using probe needles. However, often used self-learning solutions for designing these tests need a known-good-board, entailing significant disadvantages. In this paper, a software tool is described that automatically generates in-circuit tests based on the product design files, without requiring probe access on every net. Furthermore, the tool indicates where on the board fault coverage is not maximal, and hence where extra probe access will improve the test quality.

Original languageEnglish
Title of host publicationProceedings - 2nd IEEE International Test Conference in Asia, ITC-Asia 2018
PublisherInstitute of Electrical and Electronics Engineers
Pages13-18
Number of pages6
ISBN (Print)9781538651803
DOIs
Publication statusPublished - 15 Aug 2018
Event2nd IEEE International Test Conference in Asia, ITC-Asia 2018 - Harbin, China
Duration: 15 Aug 201817 Aug 2018

Conference

Conference2nd IEEE International Test Conference in Asia, ITC-Asia 2018
Country/TerritoryChina
CityHarbin
Period15/08/1817/08/18

Keywords

  • Automatic Test Generation
  • DFT
  • ICT
  • In Circuit Test

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