Atomic layer deposition of insulating alf3/polyimide nanolaminate films

Xinzhi Li; Marko Vehkamäki; Mikko Heikkilä; Miika Mattinen; Matti Putkonen; Markku Leskelä; Mikko Ritala

doi:10.3390/coatings11030355

Atomic layer deposition of insulating alf3/polyimide nanolaminate films

Xinzhi Li (Corresponding author), Marko Vehkamäki, Mikko Heikkilä, Miika Mattinen, Matti Putkonen, Markku Leskelä, Mikko Ritala (Corresponding author)

Research output: Contribution to journal › Article › Academic › peer-review

4 Citations (Scopus)

Abstract

This article describes the deposition of AlF3/polyimide nanolaminate film by inorganic-organic atomic layer deposition (ALD) at 170 °C. AlCl3 and TiF4 were used as precursors for AlF3. Polyimide layers were deposited from PMDA (pyromellitic dianhydride, 1,2,3,5-benzenetetracar-boxylic anhydride) and DAH (1,6-diaminohexane). With field-emission scanning electron micros-copy (FESEM) and X-ray reflection (XRR) analysis, it was found that the topmost layer (nominally 10 nm in thickness) of the nanolaminate film (100 nm total thickness) changed when exposed to the atmosphere. After all, the effect on roughness was minimal. The length of a delay time between the AlF3 and polyimide depositions was found to affect the sharpness of the nanolaminate structure. Electrical properties of AlF3/polyimide nanolaminate films were measured, indicating an increase in dielectric constant compared to single AlF3 and a decrease in leakage current compared to poly-imide films, respectively.

Original language	English
Article number	355
Number of pages	13
Journal	Coatings
Volume	11
Issue number	3
DOIs	https://doi.org/10.3390/coatings11030355
Publication status	Published - Mar 2021

Bibliographical note

Funding Information:
This project has received funding from the European Union?s Horizon 2020 research and innovation programme under the Marie Sk?odowska-Curie grant agreement No. 765378. M.P. acknowledges funding from the Academy of Finland by the profiling action on Matter and Materials, grant No. 318913. Open access funding provided by University of Helsinki.

Publisher Copyright:
© 2021 by the authors. Licensee MDPI, Basel, Switzerland.

Copyright:
Copyright 2021 Elsevier B.V., All rights reserved.

Funding

This project has received funding from the European Union’s Horizon 2020 research and innovation programme under the Marie Skłodowska-Curie grant agreement No. 765378. M.P. acknowledges funding from the Academy of Finland by the profiling action on Matter and Materials, grant No. 318913. Open access funding provided by University of Helsinki.

Funders	Funder number
Helsingin Yliopisto
Horizon 2020 Framework Programme
Marie Skłodowska‐Curie	765378
Academy of Finland	318913

Keywords

ALD
Low-k materials
MLD
Nanolaminate films

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10.3390/coatings11030355

Cite this

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title = "Atomic layer deposition of insulating alf3/polyimide nanolaminate films",

abstract = "This article describes the deposition of AlF3/polyimide nanolaminate film by inorganic-organic atomic layer deposition (ALD) at 170 °C. AlCl3 and TiF4 were used as precursors for AlF3. Polyimide layers were deposited from PMDA (pyromellitic dianhydride, 1,2,3,5-benzenetetracar-boxylic anhydride) and DAH (1,6-diaminohexane). With field-emission scanning electron micros-copy (FESEM) and X-ray reflection (XRR) analysis, it was found that the topmost layer (nominally 10 nm in thickness) of the nanolaminate film (100 nm total thickness) changed when exposed to the atmosphere. After all, the effect on roughness was minimal. The length of a delay time between the AlF3 and polyimide depositions was found to affect the sharpness of the nanolaminate structure. Electrical properties of AlF3/polyimide nanolaminate films were measured, indicating an increase in dielectric constant compared to single AlF3 and a decrease in leakage current compared to poly-imide films, respectively.",

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author = "Xinzhi Li and Marko Vehkam{\"a}ki and Mikko Heikkil{\"a} and Miika Mattinen and Matti Putkonen and Markku Leskel{\"a} and Mikko Ritala",

note = "Funding Information: This project has received funding from the European Union?s Horizon 2020 research and innovation programme under the Marie Sk?odowska-Curie grant agreement No. 765378. M.P. acknowledges funding from the Academy of Finland by the profiling action on Matter and Materials, grant No. 318913. Open access funding provided by University of Helsinki. Publisher Copyright: {\textcopyright} 2021 by the authors. Licensee MDPI, Basel, Switzerland. Copyright: Copyright 2021 Elsevier B.V., All rights reserved.",

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AU - Putkonen, Matti

AU - Leskelä, Markku

AU - Ritala, Mikko

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N2 - This article describes the deposition of AlF3/polyimide nanolaminate film by inorganic-organic atomic layer deposition (ALD) at 170 °C. AlCl3 and TiF4 were used as precursors for AlF3. Polyimide layers were deposited from PMDA (pyromellitic dianhydride, 1,2,3,5-benzenetetracar-boxylic anhydride) and DAH (1,6-diaminohexane). With field-emission scanning electron micros-copy (FESEM) and X-ray reflection (XRR) analysis, it was found that the topmost layer (nominally 10 nm in thickness) of the nanolaminate film (100 nm total thickness) changed when exposed to the atmosphere. After all, the effect on roughness was minimal. The length of a delay time between the AlF3 and polyimide depositions was found to affect the sharpness of the nanolaminate structure. Electrical properties of AlF3/polyimide nanolaminate films were measured, indicating an increase in dielectric constant compared to single AlF3 and a decrease in leakage current compared to poly-imide films, respectively.

AB - This article describes the deposition of AlF3/polyimide nanolaminate film by inorganic-organic atomic layer deposition (ALD) at 170 °C. AlCl3 and TiF4 were used as precursors for AlF3. Polyimide layers were deposited from PMDA (pyromellitic dianhydride, 1,2,3,5-benzenetetracar-boxylic anhydride) and DAH (1,6-diaminohexane). With field-emission scanning electron micros-copy (FESEM) and X-ray reflection (XRR) analysis, it was found that the topmost layer (nominally 10 nm in thickness) of the nanolaminate film (100 nm total thickness) changed when exposed to the atmosphere. After all, the effect on roughness was minimal. The length of a delay time between the AlF3 and polyimide depositions was found to affect the sharpness of the nanolaminate structure. Electrical properties of AlF3/polyimide nanolaminate films were measured, indicating an increase in dielectric constant compared to single AlF3 and a decrease in leakage current compared to poly-imide films, respectively.

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Atomic layer deposition of insulating alf3/polyimide nanolaminate films

Abstract

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Keywords

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