All-solid-state 3D integrated batteries can reach the energy storage capacity required for future wireless devices by exploiting the third dimension. Conformal deposition techniques such as atomic layer deposition (ALD) are needed to deposit the battery materials. In this work, the current development of ALD processes for 3D integrated batteries is reviewed. We have developed both the TiN diffusion barrier and Pt cathode current collector processes. TiN showed good barrier properties in 3D, although a higher than expected charge density was observed, which could be attributed to a lower thickness and/or different material properties at the bottom of the 3D structures. The remote plasma ALD process for Pt showed fast growth initiation and good adhesion of the films. Furthermore, sufficient step coverage for the battery application was found. ALD is also potentially able to deposit the active battery layers, although the deposition of Li-containing materials is expected to be challenging.
©2009 COPYRIGHT ECS - The Electrochemical Society
|Title of host publication||Atomic layer deposition applications 5 : Proceedings of the 216th ECS meeting, 4 - 9 October 2009, Vienna, Austria|
|Editors||S. Bent, S. Gendt, De|
|Place of Publication||Pennington, NJ|
|Publisher||Electrochemical Society, Inc.|
|Publication status||Published - 2009|