Abstract
The sixth symposium on Atomic Layer Deposition Applications was held
October 10 to October 15, 2010 in Las Vegas, Nevada, as part of the 218th Meeting of
The Electrochemical Society.
The continuously expanding realm of Atomic Layer Deposition (ALD)
applications is the focus of this symposium. ALD can enable the precise deposition of
ultra-thin, highly conformal coatings over complex, 3D topographies with controlled
composition and properties. In its 6th successful year, this symposium has become a
forum for sharing cutting edge research in the various areas where ALD is used.
Emerging and non-mainstream ALD applications are also of special interest.
This issue of ECS Transactions contains 46 peer-reviewed papers presented at
the symposium. The papers are organized into Chapters generally following the order
in which they were presented. Featured ALD topics include surface engineering and
nanofabrication, dielectrics for state-of-the-art transistors and capacitors, and the ALD
of metals and metal nitrides. A number of papers report on progress in ALD
equipment and precursor development. In addition, we held a session and panel
discussion titled "Status and Challenges in Ultrafast ALD", a topic particularly suited
for the emerging application of ALD for solar cell passivation.
| Original language | English |
|---|---|
| Place of Publication | Pennington, N.J. |
| Publisher | Electrochemical Society, Inc. |
| Number of pages | 455 |
| ISBN (Print) | 978-1-56677-821-3 |
| Publication status | Published - 2010 |