Atomic layer deposition applications 6

J.W. Elam (Editor), A. Londergan (Editor), S. Gendt, De (Editor), S.F. Bent (Editor), O. Straten, van der (Editor), F. Roozeboom (Editor), A. Delabie (Editor)

Research output: Book/ReportBook editingAcademic


The sixth symposium on Atomic Layer Deposition Applications was held October 10 to October 15, 2010 in Las Vegas, Nevada, as part of the 218th Meeting of The Electrochemical Society. The continuously expanding realm of Atomic Layer Deposition (ALD) applications is the focus of this symposium. ALD can enable the precise deposition of ultra-thin, highly conformal coatings over complex, 3D topographies with controlled composition and properties. In its 6th successful year, this symposium has become a forum for sharing cutting edge research in the various areas where ALD is used. Emerging and non-mainstream ALD applications are also of special interest. This issue of ECS Transactions contains 46 peer-reviewed papers presented at the symposium. The papers are organized into Chapters generally following the order in which they were presented. Featured ALD topics include surface engineering and nanofabrication, dielectrics for state-of-the-art transistors and capacitors, and the ALD of metals and metal nitrides. A number of papers report on progress in ALD equipment and precursor development. In addition, we held a session and panel discussion titled "Status and Challenges in Ultrafast ALD", a topic particularly suited for the emerging application of ALD for solar cell passivation.
Original languageEnglish
Place of PublicationPennington, N.J.
PublisherElectrochemical Society, Inc.
Number of pages455
ISBN (Print)978-1-56677-821-3
Publication statusPublished - 2010


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