Assessment of Different Scenarios on Input Impedance of a Thin Wire

Mohammad Khorramizadeh; L.A. Bronckers; Anne Roc'h

doi:10.1109/EMCEurope59828.2024.10722302

Assessment of Different Scenarios on Input Impedance of a Thin Wire

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

1 Citation (Scopus)

113 Downloads (Pure)

Abstract

This paper assesses effects of distinct scenarios on the measurement of the input impedance of cables connecting two
devices. The test setup comprises two vertical reference planes and a horizontal reference plane parallel to which a thin wire is
placed. The wire is soldered to SMA connectors on both sides, and these connectors are attached to the vertical reference planes.
The wire is also connected to a measurement device on one side and linked to DUTs on the other side. The DUTs represent three
extreme cases: open, short, and load terminations. Other possible scenarios fall approximately between these extremes. For each
DUT, a measurement is conducted, and a comparison is made. The results reveal that changes in the input impedance are not
solely due to the wire; rather, terminations and the reference planes of the devices also significantly impact the behavior of the
input impedance.

Original language	English
Title of host publication	International Symposium and Exhibition on Electromagnetic Compatibility, EMC Europe 2024
Publisher	Institute of Electrical and Electronics Engineers
Pages	1046-1051
Number of pages	6
ISBN (Electronic)	979-8-3503-0735-1
DOIs	https://doi.org/10.1109/EMCEurope59828.2024.10722302
Publication status	Published - 25 Oct 2024
Event	2024 International Symposium on Electromagnetic Compatibility, EMC Europe 2024 - Brugge, Bruges, Belgium Duration: 2 Sept 2024 → 5 Sept 2024 https://emceurope2024.org/

Conference

Conference	2024 International Symposium on Electromagnetic Compatibility, EMC Europe 2024
Abbreviated title	EMC Europe 2024
Country/Territory	Belgium
City	Bruges
Period	2/09/24 → 5/09/24
Internet address	https://emceurope2024.org/

Funding

This work was carried out in the framework of the EUREKA EURIPIDES2 InnoStar project (Innovative Systems and Automated Design for 5G/6G Connectivity and Radar Applications), Diarienummer 2021-0405.

Keywords

Cable
Common-mode
EMC
EMI
Input impedance
Interconnecting cables
Wire

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10.1109/EMCEurope59828.2024.10722302

Assessment of different scenarios on input impedance of cablesFinal author version , 1.14 MB
pdfFinal published version, 1.19 MBLicence: TAVERNE

Cite this

@inproceedings{e483ef3f104a48ee8820e802b71308a9,

title = "Assessment of Different Scenarios on Input Impedance of a Thin Wire",

abstract = "This paper assesses effects of distinct scenarios on the measurement of the input impedance of cables connecting two devices. The test setup comprises two vertical reference planes and a horizontal reference plane parallel to which a thin wire is placed. The wire is soldered to SMA connectors on both sides, and these connectors are attached to the vertical reference planes. The wire is also connected to a measurement device on one side and linked to DUTs on the other side. The DUTs represent three extreme cases: open, short, and load terminations. Other possible scenarios fall approximately between these extremes. For each DUT, a measurement is conducted, and a comparison is made. The results reveal that changes in the input impedance are not solely due to the wire; rather, terminations and the reference planes of the devices also significantly impact the behavior of the input impedance.",

keywords = "Cable, Common-mode, EMC, EMI, Input impedance, Interconnecting cables, Wire",

author = "Mohammad Khorramizadeh and L.A. Bronckers and Anne Roc'h",

year = "2024",

month = oct,

day = "25",

doi = "10.1109/EMCEurope59828.2024.10722302",

language = "English",

pages = "1046--1051",

booktitle = "International Symposium and Exhibition on Electromagnetic Compatibility, EMC Europe 2024",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "2024 International Symposium on Electromagnetic Compatibility, EMC Europe 2024, EMC Europe 2024 ; Conference date: 02-09-2024 Through 05-09-2024",

url = "https://emceurope2024.org/",

}

Khorramizadeh, M , Bronckers, LA & Roc'h, A 2024, Assessment of Different Scenarios on Input Impedance of a Thin Wire. in International Symposium and Exhibition on Electromagnetic Compatibility, EMC Europe 2024., 10722302, Institute of Electrical and Electronics Engineers, pp. 1046-1051, 2024 International Symposium on Electromagnetic Compatibility, EMC Europe 2024, Bruges, Belgium, 2/09/24. https://doi.org/10.1109/EMCEurope59828.2024.10722302

Assessment of Different Scenarios on Input Impedance of a Thin Wire. / Khorramizadeh, Mohammad ; Bronckers, L.A.; Roc'h, Anne.
International Symposium and Exhibition on Electromagnetic Compatibility, EMC Europe 2024. Institute of Electrical and Electronics Engineers, 2024. p. 1046-1051 10722302.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Assessment of Different Scenarios on Input Impedance of a Thin Wire

AU - Khorramizadeh, Mohammad

AU - Bronckers, L.A.

AU - Roc'h, Anne

PY - 2024/10/25

Y1 - 2024/10/25

N2 - This paper assesses effects of distinct scenarios on the measurement of the input impedance of cables connecting two devices. The test setup comprises two vertical reference planes and a horizontal reference plane parallel to which a thin wire is placed. The wire is soldered to SMA connectors on both sides, and these connectors are attached to the vertical reference planes. The wire is also connected to a measurement device on one side and linked to DUTs on the other side. The DUTs represent three extreme cases: open, short, and load terminations. Other possible scenarios fall approximately between these extremes. For each DUT, a measurement is conducted, and a comparison is made. The results reveal that changes in the input impedance are not solely due to the wire; rather, terminations and the reference planes of the devices also significantly impact the behavior of the input impedance.

AB - This paper assesses effects of distinct scenarios on the measurement of the input impedance of cables connecting two devices. The test setup comprises two vertical reference planes and a horizontal reference plane parallel to which a thin wire is placed. The wire is soldered to SMA connectors on both sides, and these connectors are attached to the vertical reference planes. The wire is also connected to a measurement device on one side and linked to DUTs on the other side. The DUTs represent three extreme cases: open, short, and load terminations. Other possible scenarios fall approximately between these extremes. For each DUT, a measurement is conducted, and a comparison is made. The results reveal that changes in the input impedance are not solely due to the wire; rather, terminations and the reference planes of the devices also significantly impact the behavior of the input impedance.

KW - Cable

KW - Common-mode

KW - EMC

KW - EMI

KW - Input impedance

KW - Interconnecting cables

KW - Wire

UR - https://www.scopus.com/pages/publications/85212242034

U2 - 10.1109/EMCEurope59828.2024.10722302

DO - 10.1109/EMCEurope59828.2024.10722302

M3 - Conference contribution

SP - 1046

EP - 1051

BT - International Symposium and Exhibition on Electromagnetic Compatibility, EMC Europe 2024

PB - Institute of Electrical and Electronics Engineers

T2 - 2024 International Symposium on Electromagnetic Compatibility, EMC Europe 2024

Y2 - 2 September 2024 through 5 September 2024

ER -

Assessment of Different Scenarios on Input Impedance of a Thin Wire

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