Assembled PCB EMC test methods

Mart Coenen, T.A.K. Gierstberg, A.H.M. Roermund, van

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)
2 Downloads (Pure)


Most often, it is unclear where assembled PCBs are going to be used in and how these are being connected and applied. As such, it will be required, both for the OEM manufacturer as well as the end-user/system integrator, to know the EMC properties prior to system integration. EMC is, aside power integrity (PI) and signal integrity (SI), one of the crucial requirements to be met to ensure functional reliability of the end-product. The EMC requirements applicable need to be uncomplicated and easy to verify in a limited amount of test time. Last but not least, these EMC tests have to be applied in an environment which is close to the end-applications foreseen; rack-mounted, stand-alone, etc. The PCB test methods proposed cover the frequency range from (DC) several Hz to several GHz, both on RF emission and immunity. By exchanging the RF disturbance source by an impulse source, the test methods proposed can also be used with impulse immunity tests.
Original languageEnglish
Title of host publicationProceedings of the 2012 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 21-24 May 2012, Singapore
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
ISBN (Print)978-1-4577-1557-0
Publication statusPublished - 2012
EventAsia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2012 - Singapore, Singapore
Duration: 21 May 201224 May 2012


ConferenceAsia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2012
Abbreviated titleAPEMC 2012


Dive into the research topics of 'Assembled PCB EMC test methods'. Together they form a unique fingerprint.

Cite this