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Arsenic ion-implanted silicon thermometer

  • Gang Chen
  • , R.W. van der Heijden
  • , A.T.A.M. de Waele
  • , H.M. Gijsman
  • , C.M. van Es
  • , F.P.B. Tielen

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Academic › peer-review

Abstract

Arsenic-doped silicon thermometers using ion implantation techniques are described for low-temperature applications such as bolometry, microcalorimetry, transient heat transfer measurements etc. Ion-implanted thermistors have the advantage of very small heat capacity and fast response. A very fine interdigital structure (5 μm characteristic dimension) was defined in the plane photolithographically. In this way, the geometric factor (= resistance-resistivity ratio) is reduced and the useful range extended. The nominal concentrations of the arsenic were chosen around the concentration of the metal-insulator transition (8.5·1018 atoms cm-3) in the range from 6.4 to 9.7·1018 atoms cm-3. Both metallic and semiconducting behaviour was observed. The electrical resistance measurements between 30 and 1 K show that the thermistors are highly temperature sensitive with |d(logR)/d(logT)|>5 and reproducible after thermal cyclings between room temperature and liquid-helium temperatures. The current-voltage characteristic is strongly nonlinear, which is attributed to an intrinsic electric field effect.

Original languageEnglish
Title of host publication1989 Cryogenic Engineering Conference
EditorsR.W. Fast
PublisherPlenum Press
Pages1551-1556
Number of pages6
Volume2
ISBN (Electronic)978-1-4613-0639-9
ISBN (Print)0306435977, 978-0-306-43597-3, 978-1-4612-7904-4
Publication statusPublished - 1990
Event1989 Cryogenic Engineering Conference - Los Angeles, CA, USA
Duration: 24 Jul 1989 → 28 Jul 1989

Publication series

NameAdvances in Cryogenic Engineering
Volume35B

Conference

Conference1989 Cryogenic Engineering Conference
CityLos Angeles, CA, USA
Period24/07/89 → 28/07/89

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