Approaches and opportunities for area-selective atomic layer deposition

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

2 Citations (Scopus)

Abstract

With conventional semiconductor fabrication based on top-down processing reaching its limits in terms of patterning resolution and alignment, there is increasing interest in the implementation of bottom-up fabrication steps. In this contribution, several approaches for bottom-up processing by area-selective atomic layer deposition (ALD) will be reviewed, and the application possibilities and the main challenges in the field will be discussed.

LanguageEnglish
Title of host publication2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Number of pages2
ISBN (Electronic)9781538648254
DOIs
StatePublished - 3 Jul 2018
Event2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018 - Hsinchu, Taiwan
Duration: 16 Apr 201819 Apr 2018

Conference

Conference2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018
CountryTaiwan
CityHsinchu
Period16/04/1819/04/18

Fingerprint

Atomic layer deposition
atomic layer epitaxy
Fabrication
fabrication
Processing
alignment
Semiconductor materials

Cite this

Mackus, A. J. M. (2018). Approaches and opportunities for area-selective atomic layer deposition. In 2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018 [8403864] Piscataway: Institute of Electrical and Electronics Engineers. DOI: 10.1109/VLSI-TSA.2018.8403864
Mackus, Adriaan J.M./ Approaches and opportunities for area-selective atomic layer deposition. 2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018. Piscataway : Institute of Electrical and Electronics Engineers, 2018.
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Mackus, AJM 2018, Approaches and opportunities for area-selective atomic layer deposition. in 2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018., 8403864, Institute of Electrical and Electronics Engineers, Piscataway, 2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018, Hsinchu, Taiwan, 16/04/18. DOI: 10.1109/VLSI-TSA.2018.8403864

Approaches and opportunities for area-selective atomic layer deposition. / Mackus, Adriaan J.M.

2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018. Piscataway : Institute of Electrical and Electronics Engineers, 2018. 8403864.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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Mackus AJM. Approaches and opportunities for area-selective atomic layer deposition. In 2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018. Piscataway: Institute of Electrical and Electronics Engineers. 2018. 8403864. Available from, DOI: 10.1109/VLSI-TSA.2018.8403864