Application of a layout design method to the dielectric deposition area in a 300 mm wafer fab

P.A.M. Haagh, A.U. Wilkens, E.J.J. Campen, van, J.E. Rooda, H.J.A. Rulkens

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

    Original languageEnglish
    Title of host publicationProceedings of ISSM '98, the 7th international symposium on semiconductor manufacturing : October 7-9, Tokyo, Japan
    EditorsT. Kawanishi, T. Ohmi, H. Sasaki
    Place of PublicationTokyo
    PublisherUltra Clean Technology
    Pages69-72
    Publication statusPublished - 1998

    Cite this

    Haagh, P. A. M., Wilkens, A. U., Campen, van, E. J. J., Rooda, J. E., & Rulkens, H. J. A. (1998). Application of a layout design method to the dielectric deposition area in a 300 mm wafer fab. In T. Kawanishi, T. Ohmi, & H. Sasaki (Eds.), Proceedings of ISSM '98, the 7th international symposium on semiconductor manufacturing : October 7-9, Tokyo, Japan (pp. 69-72). Ultra Clean Technology.