Antenna-on-chip integration in mainstream silicon semiconductor technologies

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Abstract

The mobile data traffic is rapidly increasing. Several bands have been identified in the millimetre-wave spectrum that could be used to support the expected average smartphone traffic of 6.8 GB in 2021. Due to the short wavelength at those frequencies, the antennas can and should be integrated together with the front-end electronics. This paper provides an overview of integration approaches developed at the Centre for Wireless Technology Eindhoven. Moreover, it provides a comparison of the presented concepts in terms of performance and relative cost. The conclusion is drawn that in-package antennas seem to be the best integration approach for frequencies considered for 5G and a general guideline is provided for frequencies beyond 5G.

Original languageEnglish
Title of host publication12th European Conference on Antennas and Propagation (EuCAP 2018)
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Number of pages5
ISBN (Electronic)978-1-78561-816-1
DOIs
Publication statusPublished - 1 Jan 2018
Event12th European Conference on Antennas and Propagation, EuCAP 2018 - London, United Kingdom
Duration: 9 Apr 201813 Apr 2018

Conference

Conference12th European Conference on Antennas and Propagation, EuCAP 2018
CountryUnited Kingdom
CityLondon
Period9/04/1813/04/18

Keywords

  • 5G
  • Antenna-in-Package
  • Antenna-on-Chip
  • Millimeter-wave antenna

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  • Cite this

    Johannsen, U., & Smolders, A. B. (2018). Antenna-on-chip integration in mainstream silicon semiconductor technologies. In 12th European Conference on Antennas and Propagation (EuCAP 2018) [8568617] Piscataway: Institute of Electrical and Electronics Engineers. https://doi.org/10.1049/cp.2018.0939