Analysis of Cu/low-k bond pad delamination by using a novel failure index

M.A.J. Gils, van, O. Sluis, van der, G.Q. Zhang, J.H.J. Janssen, R.M.J. Voncken

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

15 Citations (Scopus)

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