Analysis of 60 GHz flip-chipped package using EM tool-based time-domain reflectometry

M.I. Kazim, M.H.A.J. Herben

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Abstract

A systematic approach based on ‘package-peeling’ together with time-domain reflectometry (TDR) for package characterization using an EM-tool is presented. The said methodology is applied to investigate and address the possible causes of transmission losses for a measured 60 GHz flip-chipped package, embedding a power amplifier (PA) and a balanced-fed-aperture-coupled-patch (BFACP) antenna with an anisotropic conductive adhesive (ACA) flip-chip interconnection scheme. The proposed technique caters for TDR measurement system limitations and aids in investigation and improving the performance of the millimeter-wave flip-chipped packages.
Original languageEnglish
Title of host publicationProceedings of the 6th European Conference on Antennas and Propagation (EUCAP2012), 26-30 March 2012, Prague, Czech Republic
Pages1-5
Publication statusPublished - 2012

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