Analysis of 60 GHz flip-chipped package using EM tool-based time-domain reflectometry

M.I. Kazim; M.H.A.J. Herben

Analysis of 60 GHz flip-chipped package using EM tool-based time-domain reflectometry

M.I. Kazim, M.H.A.J. Herben

Electromagnetics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

A systematic approach based on ‘package-peeling’ together with time-domain reflectometry (TDR) for package characterization using an EM-tool is presented. The said methodology is applied to investigate and address the possible causes of transmission losses for a measured 60 GHz flip-chipped package, embedding a power amplifier (PA) and a balanced-fed-aperture-coupled-patch (BFACP) antenna with an anisotropic conductive adhesive (ACA) flip-chip interconnection scheme. The proposed technique caters for TDR measurement system limitations and aids in investigation and improving the performance of the millimeter-wave flip-chipped packages.

Original language	English
Title of host publication	Proceedings of the 6th European Conference on Antennas and Propagation (EUCAP2012), 26-30 March 2012, Prague, Czech Republic
Pages	1-5
Publication status	Published - 2012

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title = "Analysis of 60 GHz flip-chipped package using EM tool-based time-domain reflectometry",

abstract = "A systematic approach based on {\textquoteleft}package-peeling{\textquoteright} together with time-domain reflectometry (TDR) for package characterization using an EM-tool is presented. The said methodology is applied to investigate and address the possible causes of transmission losses for a measured 60 GHz flip-chipped package, embedding a power amplifier (PA) and a balanced-fed-aperture-coupled-patch (BFACP) antenna with an anisotropic conductive adhesive (ACA) flip-chip interconnection scheme. The proposed technique caters for TDR measurement system limitations and aids in investigation and improving the performance of the millimeter-wave flip-chipped packages.",

author = "M.I. Kazim and M.H.A.J. Herben",

year = "2012",

language = "English",

isbn = "978-1-4577-0919-7",

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booktitle = "Proceedings of the 6th European Conference on Antennas and Propagation (EUCAP2012), 26-30 March 2012, Prague, Czech Republic",

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Analysis of 60 GHz flip-chipped package using EM tool-based time-domain reflectometry. / Kazim, M.I.; Herben, M.H.A.J.
Proceedings of the 6th European Conference on Antennas and Propagation (EUCAP2012), 26-30 March 2012, Prague, Czech Republic. 2012. p. 1-5.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

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AU - Kazim, M.I.

AU - Herben, M.H.A.J.

PY - 2012

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N2 - A systematic approach based on ‘package-peeling’ together with time-domain reflectometry (TDR) for package characterization using an EM-tool is presented. The said methodology is applied to investigate and address the possible causes of transmission losses for a measured 60 GHz flip-chipped package, embedding a power amplifier (PA) and a balanced-fed-aperture-coupled-patch (BFACP) antenna with an anisotropic conductive adhesive (ACA) flip-chip interconnection scheme. The proposed technique caters for TDR measurement system limitations and aids in investigation and improving the performance of the millimeter-wave flip-chipped packages.

AB - A systematic approach based on ‘package-peeling’ together with time-domain reflectometry (TDR) for package characterization using an EM-tool is presented. The said methodology is applied to investigate and address the possible causes of transmission losses for a measured 60 GHz flip-chipped package, embedding a power amplifier (PA) and a balanced-fed-aperture-coupled-patch (BFACP) antenna with an anisotropic conductive adhesive (ACA) flip-chip interconnection scheme. The proposed technique caters for TDR measurement system limitations and aids in investigation and improving the performance of the millimeter-wave flip-chipped packages.

M3 - Conference contribution

SN - 978-1-4577-0919-7

SP - 1

EP - 5

BT - Proceedings of the 6th European Conference on Antennas and Propagation (EUCAP2012), 26-30 March 2012, Prague, Czech Republic

ER -

Analysis of 60 GHz flip-chipped package using EM tool-based time-domain reflectometry

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