Analog to digital converters on plastic foils

S. Abdinia; D. Raiteri; S. Jacob; R. Coppard; P. Lieshout, van; G. Palmisano; A Scuderi; A.H.M. Roermund, van; E. Cantatore

doi:10.1109/ICICDT.2013.6563318

Analog to digital converters on plastic foils

S. Abdinia, D. Raiteri, S. Jacob, R. Coppard, P. Lieshout, van, G. Palmisano, A Scuderi, A.H.M. Roermund, van, E. Cantatore

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

Circuits based on transistors which are manufactured at near-to-ambient temperatures on plastic foils are suited for mechanically flexible and large-area applications. Examples include bendable displays, large-area sensor surfaces for man-machine interfaces, and sensors-augmented RFIDs embedded in packaging material for food monitoring. This paper discusses circuit and system-level techniques that, minimizing the impact of the poor matching of organic transistors, enable analog to digital converters manufactured using unipolar and complementary organic technologies.

Original language	English
Title of host publication	Proceedings of the international conference on IC design and technology (ICICDT2013), 30-31 May 2013, Pavia, Italy
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	123-126
ISBN (Print)	978-1-4673-4740-2
DOIs	https://doi.org/10.1109/ICICDT.2013.6563318
Publication status	Published - 2013
Event	conference; International Conference on IC Design and Technology (ICICDT); 2013-05-30; 2013-05-31 - Duration: 30 May 2013 → 31 May 2013

Conference

Conference	conference; International Conference on IC Design and Technology (ICICDT); 2013-05-30; 2013-05-31
Period	30/05/13 → 31/05/13
Other	International Conference on IC Design and Technology (ICICDT)

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10.1109/ICICDT.2013.6563318

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Abdinia, S., Raiteri, D., Jacob, S., Coppard, R., Lieshout, van, P., Palmisano, G., Scuderi, A., Roermund, van, A. H. M., & Cantatore, E. (2013). Analog to digital converters on plastic foils. In Proceedings of the international conference on IC design and technology (ICICDT2013), 30-31 May 2013, Pavia, Italy (pp. 123-126). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ICICDT.2013.6563318

Abdinia, S. ; Raiteri, D. ; Jacob, S. ; Coppard, R. ; Lieshout, van, P. ; Palmisano, G. ; Scuderi, A ; Roermund, van, A.H.M. ; Cantatore, E. / Analog to digital converters on plastic foils. Proceedings of the international conference on IC design and technology (ICICDT2013), 30-31 May 2013, Pavia, Italy. Piscataway : Institute of Electrical and Electronics Engineers, 2013. pp. 123-126

@inproceedings{d977cea4979744ae853472a8a0816864,

title = "Analog to digital converters on plastic foils",

abstract = "Circuits based on transistors which are manufactured at near-to-ambient temperatures on plastic foils are suited for mechanically flexible and large-area applications. Examples include bendable displays, large-area sensor surfaces for man-machine interfaces, and sensors-augmented RFIDs embedded in packaging material for food monitoring. This paper discusses circuit and system-level techniques that, minimizing the impact of the poor matching of organic transistors, enable analog to digital converters manufactured using unipolar and complementary organic technologies.",

author = "S. Abdinia and D. Raiteri and S. Jacob and R. Coppard and {Lieshout, van}, P. and G. Palmisano and A Scuderi and {Roermund, van}, A.H.M. and E. Cantatore",

year = "2013",

doi = "10.1109/ICICDT.2013.6563318",

language = "English",

isbn = "978-1-4673-4740-2",

pages = "123--126",

booktitle = "Proceedings of the international conference on IC design and technology (ICICDT2013), 30-31 May 2013, Pavia, Italy",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "conference; International Conference on IC Design and Technology (ICICDT); 2013-05-30; 2013-05-31 ; Conference date: 30-05-2013 Through 31-05-2013",

}

Abdinia, S, Raiteri, D, Jacob, S, Coppard, R, Lieshout, van, P, Palmisano, G, Scuderi, A, Roermund, van, AHM & Cantatore, E 2013, Analog to digital converters on plastic foils. in Proceedings of the international conference on IC design and technology (ICICDT2013), 30-31 May 2013, Pavia, Italy. Institute of Electrical and Electronics Engineers, Piscataway, pp. 123-126, conference; International Conference on IC Design and Technology (ICICDT); 2013-05-30; 2013-05-31, 30/05/13. https://doi.org/10.1109/ICICDT.2013.6563318

Analog to digital converters on plastic foils. / Abdinia, S.; Raiteri, D.; Jacob, S.; Coppard, R.; Lieshout, van, P.; Palmisano, G.; Scuderi, A; Roermund, van, A.H.M.; Cantatore, E.

Proceedings of the international conference on IC design and technology (ICICDT2013), 30-31 May 2013, Pavia, Italy. Piscataway : Institute of Electrical and Electronics Engineers, 2013. p. 123-126.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Analog to digital converters on plastic foils

AU - Abdinia, S.

AU - Raiteri, D.

AU - Jacob, S.

AU - Coppard, R.

AU - Lieshout, van, P.

AU - Palmisano, G.

AU - Scuderi, A

AU - Roermund, van, A.H.M.

AU - Cantatore, E.

PY - 2013

Y1 - 2013

N2 - Circuits based on transistors which are manufactured at near-to-ambient temperatures on plastic foils are suited for mechanically flexible and large-area applications. Examples include bendable displays, large-area sensor surfaces for man-machine interfaces, and sensors-augmented RFIDs embedded in packaging material for food monitoring. This paper discusses circuit and system-level techniques that, minimizing the impact of the poor matching of organic transistors, enable analog to digital converters manufactured using unipolar and complementary organic technologies.

AB - Circuits based on transistors which are manufactured at near-to-ambient temperatures on plastic foils are suited for mechanically flexible and large-area applications. Examples include bendable displays, large-area sensor surfaces for man-machine interfaces, and sensors-augmented RFIDs embedded in packaging material for food monitoring. This paper discusses circuit and system-level techniques that, minimizing the impact of the poor matching of organic transistors, enable analog to digital converters manufactured using unipolar and complementary organic technologies.

U2 - 10.1109/ICICDT.2013.6563318

DO - 10.1109/ICICDT.2013.6563318

M3 - Conference contribution

SN - 978-1-4673-4740-2

SP - 123

EP - 126

BT - Proceedings of the international conference on IC design and technology (ICICDT2013), 30-31 May 2013, Pavia, Italy

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

T2 - conference; International Conference on IC Design and Technology (ICICDT); 2013-05-30; 2013-05-31

Y2 - 30 May 2013 through 31 May 2013

ER -

Analog to digital converters on plastic foils

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