Abstract
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the international conference on IC design and technology (ICICDT2013), 30-31 May 2013, Pavia, Italy |
| Place of Publication | Piscataway |
| Publisher | Institute of Electrical and Electronics Engineers |
| Pages | 123-126 |
| ISBN (Print) | 978-1-4673-4740-2 |
| DOIs | |
| Publication status | Published - 2013 |
| Event | conference; International Conference on IC Design and Technology (ICICDT); 2013-05-30; 2013-05-31 - Duration: 30 May 2013 → 31 May 2013 |
Conference
| Conference | conference; International Conference on IC Design and Technology (ICICDT); 2013-05-30; 2013-05-31 |
|---|---|
| Period | 30/05/13 → 31/05/13 |
| Other | International Conference on IC Design and Technology (ICICDT) |
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Analog to digital converters on plastic foils. / Abdinia, S.; Raiteri, D.; Jacob, S.; Coppard, R.; Lieshout, van, P.; Palmisano, G.; Scuderi, A; Roermund, van, A.H.M.; Cantatore, E.
Proceedings of the international conference on IC design and technology (ICICDT2013), 30-31 May 2013, Pavia, Italy. Piscataway : Institute of Electrical and Electronics Engineers, 2013. p. 123-126.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review
TY - GEN
T1 - Analog to digital converters on plastic foils
AU - Abdinia, S.
AU - Raiteri, D.
AU - Jacob, S.
AU - Coppard, R.
AU - Lieshout, van, P.
AU - Palmisano, G.
AU - Scuderi, A
AU - Roermund, van, A.H.M.
AU - Cantatore, E.
PY - 2013
Y1 - 2013
N2 - Circuits based on transistors which are manufactured at near-to-ambient temperatures on plastic foils are suited for mechanically flexible and large-area applications. Examples include bendable displays, large-area sensor surfaces for man-machine interfaces, and sensors-augmented RFIDs embedded in packaging material for food monitoring. This paper discusses circuit and system-level techniques that, minimizing the impact of the poor matching of organic transistors, enable analog to digital converters manufactured using unipolar and complementary organic technologies.
AB - Circuits based on transistors which are manufactured at near-to-ambient temperatures on plastic foils are suited for mechanically flexible and large-area applications. Examples include bendable displays, large-area sensor surfaces for man-machine interfaces, and sensors-augmented RFIDs embedded in packaging material for food monitoring. This paper discusses circuit and system-level techniques that, minimizing the impact of the poor matching of organic transistors, enable analog to digital converters manufactured using unipolar and complementary organic technologies.
U2 - 10.1109/ICICDT.2013.6563318
DO - 10.1109/ICICDT.2013.6563318
M3 - Conference contribution
SN - 978-1-4673-4740-2
SP - 123
EP - 126
BT - Proceedings of the international conference on IC design and technology (ICICDT2013), 30-31 May 2013, Pavia, Italy
PB - Institute of Electrical and Electronics Engineers
CY - Piscataway
ER -