Advances in delamination modeling

O. Sluis, van der, C.A. Yuan, W.D. Driel, van, G.Q. Zhang

Research output: Chapter in Book/Report/Conference proceedingChapterAcademic

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Abstract

Today’s microelectronic packages are typically composed of various materials, like silicon, metals, oxides, glues, and compounds (polymers). In Fig. 4.1, cross sections of a leadframe- and substrate-based package are depicted. Due to the dissimilar nature of these materials and the inherent presence of a large number of interfaces in each component, various failure modes, such as interface delamination, chip cracking, and/or solder fatigue, will occur during processing (qualification), testing, or usage. The occurring thermomechanically related failures in these components account for more than 65% of the total reliability issues.
Original languageEnglish
Title of host publicationNanopackaging : nanotechnologies and electronics packaging
EditorsJ.E. Morris
Place of PublicationNew York
PublisherSpringer
Pages61-91
ISBN (Print)978-0-387-47325-3
DOIs
Publication statusPublished - 2008

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Delamination
Glues
Microelectronics
Soldering alloys
Failure modes
Fatigue of materials
Silicon
Oxides
Testing
Polymers
Substrates
Processing
Metals

Cite this

Sluis, van der, O., Yuan, C. A., Driel, van, W. D., & Zhang, G. Q. (2008). Advances in delamination modeling. In J. E. Morris (Ed.), Nanopackaging : nanotechnologies and electronics packaging (pp. 61-91). New York: Springer. https://doi.org/10.1007/978-0-387-47325-3_4
Sluis, van der, O. ; Yuan, C.A. ; Driel, van, W.D. ; Zhang, G.Q. / Advances in delamination modeling. Nanopackaging : nanotechnologies and electronics packaging. editor / J.E. Morris. New York : Springer, 2008. pp. 61-91
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Sluis, van der, O, Yuan, CA, Driel, van, WD & Zhang, GQ 2008, Advances in delamination modeling. in JE Morris (ed.), Nanopackaging : nanotechnologies and electronics packaging. Springer, New York, pp. 61-91. https://doi.org/10.1007/978-0-387-47325-3_4

Advances in delamination modeling. / Sluis, van der, O.; Yuan, C.A.; Driel, van, W.D.; Zhang, G.Q.

Nanopackaging : nanotechnologies and electronics packaging. ed. / J.E. Morris. New York : Springer, 2008. p. 61-91.

Research output: Chapter in Book/Report/Conference proceedingChapterAcademic

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BT - Nanopackaging : nanotechnologies and electronics packaging

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Sluis, van der O, Yuan CA, Driel, van WD, Zhang GQ. Advances in delamination modeling. In Morris JE, editor, Nanopackaging : nanotechnologies and electronics packaging. New York: Springer. 2008. p. 61-91 https://doi.org/10.1007/978-0-387-47325-3_4