Adhesive bonding of InP/InGaAsP dies to processed silicon-on-insulator wafers using DVS-bis-benzocyclobutene

G. Roelkens, J. Brouckaert, D. Thourhout, Van, R.G.F. Baets, R. Nötzel, M.K. Smit

Research output: Contribution to journal › Article › Academic › peer-review

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