Adhesion composition comprising a formaldehyde-containing aminoplast resin and a catalysing compound

Rolf A.T.M. van Benthem (Inventor), J.L. de Haas (Inventor), A.E.H. de Keijzer (Inventor), K.F.H. Bonekamp (Inventor)

Research output: PatentPatent publication

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Abstract

The invention relates to an adhesive composition comprising a formaldehyde-containing aminoplast resin and a catalysing compound, with the catalysing compound being an acid or is able to release an acid with a pKa lower than 4 and with the formaldehyde-containing aminoplast resin having a F/(NH2) 2 ratio lower than or equal to 1. The catalysing compound comprises at most 11 wt.% of an ammonium salt. The invention also relates to a process for the preparation of board material using the adhesive composition according to the invention and to the board material thus obtainable.
Original languageEnglish
Patent numberWO/2005/010119
Priority date28/07/03
Filing date27/07/04
Publication statusPublished - 3 Feb 2005

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