Adhesion composition comprising a formaldehyde-containing aminoplast resin and a catalysing compound

Rolf A.T.M. van Benthem; J.L. de Haas; A.E.H. de Keijzer; K.F.H. Bonekamp

Adhesion composition comprising a formaldehyde-containing aminoplast resin and a catalysing compound

Rolf A.T.M. van Benthem (Inventor), J.L. de Haas (Inventor), A.E.H. de Keijzer (Inventor), K.F.H. Bonekamp (Inventor)

Physical Chemistry

Research output: Patent › Patent publication

1 Downloads (Pure)

Abstract

The invention relates to an adhesive composition comprising a formaldehyde-containing aminoplast resin and a catalysing compound, with the catalysing compound being an acid or is able to release an acid with a pKa lower than 4 and with the formaldehyde-containing aminoplast resin having a F/(NH2) 2 ratio lower than or equal to 1. The catalysing compound comprises at most 11 wt.% of an ammonium salt. The invention also relates to a process for the preparation of board material using the adhesive composition according to the invention and to the board material thus obtainable.

Original language	English
Patent number	WO/2005/010119
Priority date	28/07/03
Filing date	27/07/04
Publication status	Published - 3 Feb 2005

Access to Document

WO2005010119A2_Original_document_20210112154048Final published version, 1.44 MB

Espacenet

Fingerprint Dive into the research topics of 'Adhesion composition comprising a formaldehyde-containing aminoplast resin and a catalysing compound'. Together they form a unique fingerprint.

Cite this

@misc{02446d8366364ae58b6d70f6b7bad0dc,

title = "Adhesion composition comprising a formaldehyde-containing aminoplast resin and a catalysing compound",

abstract = "The invention relates to an adhesive composition comprising a formaldehyde-containing aminoplast resin and a catalysing compound, with the catalysing compound being an acid or is able to release an acid with a pKa lower than 4 and with the formaldehyde-containing aminoplast resin having a F/(NH2) 2 ratio lower than or equal to 1. The catalysing compound comprises at most 11 wt.% of an ammonium salt. The invention also relates to a process for the preparation of board material using the adhesive composition according to the invention and to the board material thus obtainable.",

author = "{van Benthem}, {Rolf A.T.M.} and {de Haas}, J.L. and {de Keijzer}, A.E.H. and K.F.H. Bonekamp",

year = "2005",

month = feb,

day = "3",

language = "English",

publisher = "Koninklijke DSM N.V.",

type = "Patent",

note = "WO/2005/010119",

}

TY - PAT

T1 - Adhesion composition comprising a formaldehyde-containing aminoplast resin and a catalysing compound

AU - van Benthem, Rolf A.T.M.

AU - de Haas, J.L.

AU - de Keijzer, A.E.H.

AU - Bonekamp, K.F.H.

PY - 2005/2/3

Y1 - 2005/2/3

N2 - The invention relates to an adhesive composition comprising a formaldehyde-containing aminoplast resin and a catalysing compound, with the catalysing compound being an acid or is able to release an acid with a pKa lower than 4 and with the formaldehyde-containing aminoplast resin having a F/(NH2) 2 ratio lower than or equal to 1. The catalysing compound comprises at most 11 wt.% of an ammonium salt. The invention also relates to a process for the preparation of board material using the adhesive composition according to the invention and to the board material thus obtainable.

AB - The invention relates to an adhesive composition comprising a formaldehyde-containing aminoplast resin and a catalysing compound, with the catalysing compound being an acid or is able to release an acid with a pKa lower than 4 and with the formaldehyde-containing aminoplast resin having a F/(NH2) 2 ratio lower than or equal to 1. The catalysing compound comprises at most 11 wt.% of an ammonium salt. The invention also relates to a process for the preparation of board material using the adhesive composition according to the invention and to the board material thus obtainable.

UR - https://worldwide.espacenet.com/patent/search/family/034108619/publication/WO2005010119A2?q=pn%3DWO2005010119

M3 - Patent publication

M1 - WO/2005/010119

Y2 - 2004/07/27

PB - Koninklijke DSM N.V.

ER -