Abstract
The invention relates to an adhesive composition comprising a formaldehyde-containing aminoplast resin and a catalysing compound, with the catalysing compound being an acid or is able to release an acid with a pKa lower than 4 and with the formaldehyde-containing aminoplast resin having a F/(NH2) 2 ratio lower than or equal to 1. The catalysing compound comprises at most 11 wt.% of an ammonium salt. The invention also relates to a process for the preparation of board material using the adhesive composition according to the invention and to the board material thus obtainable.
| Original language | English |
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| Patent number | WO/2005/010119 |
| Priority date | 28/07/03 |
| Filing date | 27/07/04 |
| Publication status | Published - 3 Feb 2005 |