Active-matrix IGZO array with printed thermistor for large-area thermal imaging

Jan Laurens P.J. van der Steen, Laurens C.J.M. Peters, Edsger C.P. Smits, Peter Zalar, Gerwin H. Gelinck

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Abstract

Thermal imagers conventionally consist of a suspended sensing element on support structure with patterned thermal detection layer to get good thermal isolation between sensor elements[1]. Large area and wearable thermal imaging applications require cost effective fabrication, robustness and a flexible form factor. We present a 16×16 active-matrix IGZO array integrated with a screen printed thermistor on a thin and flexible substrate. Screen printing of the thermistor together with a flat-panel compatible backplane technology provides a cost effective and scalable route to large area thermal imaging. Unlike conventional focal plane arrays and microbolometers, in this work no suspended structures are used. Thus, the challenge is to get sufficient thermal separation between the imager elements, in particular when the thermistor is a single, non-structured layer extending across the entire backplane. The thermal response is determined by the thermal detection layer and the substrate, limiting the thermal response time τ = C/G, with C the thermal capacitance and G the thermal conductance. We show that by integration on thin polyimide film the thermal time constant improves by a factor of 30 compared to the same thermistor array on glass. In addition, we show that the thermal response can be further improved by reducing the thickness of (mainly) the printed thermistor layer. A stretchable form factor can be achieved through the formation of thermistor islands, connected by meander-shaped interconnects, enabling large area thermal imaging on conformal surfaces down to millimeter spatial resolution.

LanguageEnglish
Title of host publicationFLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Number of pages3
ISBN (Electronic)978-1-5386-9304-9
DOIs
StatePublished - 1 Jul 2019
Event1st IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019 - Glasgow, United Kingdom
Duration: 7 Jul 201910 Jul 2019

Conference

Conference1st IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019
CountryUnited Kingdom
CityGlasgow
Period7/07/1910/07/19

Fingerprint

Thermistors
thermistors
Infrared imaging
matrices
form factors
costs
meanders
focal plane devices
Image sensors
polyimides
printing
time constant
Hot Temperature
isolation
spatial resolution
capacitance
routes
Focal plane arrays
Screen printing
fabrication

Cite this

van der Steen, J. L. P. J., Peters, L. C. J. M., Smits, E. C. P., Zalar, P., & Gelinck, G. H. (2019). Active-matrix IGZO array with printed thermistor for large-area thermal imaging. In FLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings [8792229] Piscataway: Institute of Electrical and Electronics Engineers. DOI: 10.1109/FLEPS.2019.8792229
van der Steen, Jan Laurens P.J. ; Peters, Laurens C.J.M. ; Smits, Edsger C.P. ; Zalar, Peter ; Gelinck, Gerwin H./ Active-matrix IGZO array with printed thermistor for large-area thermal imaging. FLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings. Piscataway : Institute of Electrical and Electronics Engineers, 2019.
@inproceedings{615566822c374d7b97ddd065ff01f2ad,
title = "Active-matrix IGZO array with printed thermistor for large-area thermal imaging",
abstract = "Thermal imagers conventionally consist of a suspended sensing element on support structure with patterned thermal detection layer to get good thermal isolation between sensor elements[1]. Large area and wearable thermal imaging applications require cost effective fabrication, robustness and a flexible form factor. We present a 16×16 active-matrix IGZO array integrated with a screen printed thermistor on a thin and flexible substrate. Screen printing of the thermistor together with a flat-panel compatible backplane technology provides a cost effective and scalable route to large area thermal imaging. Unlike conventional focal plane arrays and microbolometers, in this work no suspended structures are used. Thus, the challenge is to get sufficient thermal separation between the imager elements, in particular when the thermistor is a single, non-structured layer extending across the entire backplane. The thermal response is determined by the thermal detection layer and the substrate, limiting the thermal response time τ = C/G, with C the thermal capacitance and G the thermal conductance. We show that by integration on thin polyimide film the thermal time constant improves by a factor of 30 compared to the same thermistor array on glass. In addition, we show that the thermal response can be further improved by reducing the thickness of (mainly) the printed thermistor layer. A stretchable form factor can be achieved through the formation of thermistor islands, connected by meander-shaped interconnects, enabling large area thermal imaging on conformal surfaces down to millimeter spatial resolution.",
author = "{van der Steen}, {Jan Laurens P.J.} and Peters, {Laurens C.J.M.} and Smits, {Edsger C.P.} and Peter Zalar and Gelinck, {Gerwin H.}",
year = "2019",
month = "7",
day = "1",
doi = "10.1109/FLEPS.2019.8792229",
language = "English",
booktitle = "FLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings",
publisher = "Institute of Electrical and Electronics Engineers",
address = "United States",

}

van der Steen, JLPJ, Peters, LCJM, Smits, ECP, Zalar, P & Gelinck, GH 2019, Active-matrix IGZO array with printed thermistor for large-area thermal imaging. in FLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings., 8792229, Institute of Electrical and Electronics Engineers, Piscataway, 1st IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019, Glasgow, United Kingdom, 7/07/19. DOI: 10.1109/FLEPS.2019.8792229

Active-matrix IGZO array with printed thermistor for large-area thermal imaging. / van der Steen, Jan Laurens P.J.; Peters, Laurens C.J.M.; Smits, Edsger C.P.; Zalar, Peter; Gelinck, Gerwin H.

FLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings. Piscataway : Institute of Electrical and Electronics Engineers, 2019. 8792229.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

TY - GEN

T1 - Active-matrix IGZO array with printed thermistor for large-area thermal imaging

AU - van der Steen,Jan Laurens P.J.

AU - Peters,Laurens C.J.M.

AU - Smits,Edsger C.P.

AU - Zalar,Peter

AU - Gelinck,Gerwin H.

PY - 2019/7/1

Y1 - 2019/7/1

N2 - Thermal imagers conventionally consist of a suspended sensing element on support structure with patterned thermal detection layer to get good thermal isolation between sensor elements[1]. Large area and wearable thermal imaging applications require cost effective fabrication, robustness and a flexible form factor. We present a 16×16 active-matrix IGZO array integrated with a screen printed thermistor on a thin and flexible substrate. Screen printing of the thermistor together with a flat-panel compatible backplane technology provides a cost effective and scalable route to large area thermal imaging. Unlike conventional focal plane arrays and microbolometers, in this work no suspended structures are used. Thus, the challenge is to get sufficient thermal separation between the imager elements, in particular when the thermistor is a single, non-structured layer extending across the entire backplane. The thermal response is determined by the thermal detection layer and the substrate, limiting the thermal response time τ = C/G, with C the thermal capacitance and G the thermal conductance. We show that by integration on thin polyimide film the thermal time constant improves by a factor of 30 compared to the same thermistor array on glass. In addition, we show that the thermal response can be further improved by reducing the thickness of (mainly) the printed thermistor layer. A stretchable form factor can be achieved through the formation of thermistor islands, connected by meander-shaped interconnects, enabling large area thermal imaging on conformal surfaces down to millimeter spatial resolution.

AB - Thermal imagers conventionally consist of a suspended sensing element on support structure with patterned thermal detection layer to get good thermal isolation between sensor elements[1]. Large area and wearable thermal imaging applications require cost effective fabrication, robustness and a flexible form factor. We present a 16×16 active-matrix IGZO array integrated with a screen printed thermistor on a thin and flexible substrate. Screen printing of the thermistor together with a flat-panel compatible backplane technology provides a cost effective and scalable route to large area thermal imaging. Unlike conventional focal plane arrays and microbolometers, in this work no suspended structures are used. Thus, the challenge is to get sufficient thermal separation between the imager elements, in particular when the thermistor is a single, non-structured layer extending across the entire backplane. The thermal response is determined by the thermal detection layer and the substrate, limiting the thermal response time τ = C/G, with C the thermal capacitance and G the thermal conductance. We show that by integration on thin polyimide film the thermal time constant improves by a factor of 30 compared to the same thermistor array on glass. In addition, we show that the thermal response can be further improved by reducing the thickness of (mainly) the printed thermistor layer. A stretchable form factor can be achieved through the formation of thermistor islands, connected by meander-shaped interconnects, enabling large area thermal imaging on conformal surfaces down to millimeter spatial resolution.

UR - http://www.scopus.com/inward/record.url?scp=85071367220&partnerID=8YFLogxK

U2 - 10.1109/FLEPS.2019.8792229

DO - 10.1109/FLEPS.2019.8792229

M3 - Conference contribution

BT - FLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

ER -

van der Steen JLPJ, Peters LCJM, Smits ECP, Zalar P, Gelinck GH. Active-matrix IGZO array with printed thermistor for large-area thermal imaging. In FLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings. Piscataway: Institute of Electrical and Electronics Engineers. 2019. 8792229. Available from, DOI: 10.1109/FLEPS.2019.8792229