Accurate thermal transient measurements interpretation of monochromatic LEDs

Alexeev Anton, Genevieve Martin, Grigory Onushkin, Jean Paul Linnartz

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

3 Citations (Scopus)

Abstract

In this work we determine the factors that influence the accuracy of LEDs thermal transient analysis, in particular, the leakage of heat into the dome material and the parasitic generation of heat on the reflector cup surface due to the light reflection losses are considered. Our analysis indicates a significant impact of these two factors on interpretation of the thermal transient measurements of mid-power LEDs. The paper demonstrates the significance of the physical phenomena behind these factors for creation of LEDs finiteelement thermal models. We quantify the inaccuracies in the thermal structure functions associated with these effects. We determine possible inaccuracies of finite-element models parameters calibration by thermal structure function or transient thermal response alignment if these factors are not accounted for. We show a substantial impact of the parasitic heat losses on the LEDs' reflector cup surface on the results of thermal transient for LEDs with high internal quantum efficiency encapsulated in packages with low light extraction efficiency.

Original languageEnglish
Title of host publication35th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers
Pages7-11
Number of pages5
ISBN (Electronic)9781735532509
Publication statusPublished - Mar 2019
Event35th Annual Thermal Measurement, Modeling and Management Symposium (SEMI-THERM 35)
: Thermal Innovations that Make the World’s Technology Cool
- Doubletree by Hilton, San Jose, United States
Duration: 18 Mar 201922 Mar 2019

Conference

Conference35th Annual Thermal Measurement, Modeling and Management Symposium (SEMI-THERM 35)
Country/TerritoryUnited States
CitySan Jose
Period18/03/1922/03/19

Bibliographical note

Publisher Copyright:
© 2019 STEF.

Keywords

  • Dynamic Thermal Compact Model
  • Finite Element Analysis
  • LED
  • Reliability
  • Secondary Heat Path
  • Thermal Transient Testing

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