A wideband contactless and bondwire-free MMIC to waveguide transition

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Abstract

A contactless transition from a high-permittivity microstrip line (εr = 9.9) to an air-filled waveguide (WG) has been impedance-matched over a large simulated relative bandwidth of 38% (W-band, 75–110 GHz). The transition couples the EM fields directly from the MMIC’s microstrip line via an SIW and an off-chip stub section to a ridge WG section. The novel structure is low loss and suits pick-and-place assembly techniques of mm-Wave MMICs inside metal WGs. The design process is detailed and manufacturing tolerances of the Alumina prototype PCB are discussed. The measured back-to-back structure retains an appreciable insertion loss smaller than 0.8 dB for a single transition and a fractional bandwidth of 28% (72–95 GHz) over which the return loss is greater than 10 dB.
Original languageEnglish
Article number7911264
Pages (from-to)437-439
Number of pages3
JournalIEEE Microwave and Wireless Components Letters
Volume27
Issue number5
DOIs
Publication statusPublished - 25 Apr 2017

Keywords

  • Contactless connection
  • Integration
  • Monolithic Microwave Integrated Circuit (MMICs)
  • Waveguide (WG) transition

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