A study on changes in surface chemistry during the initial stages of electroless Ni(P) deposition on alumina

J.W. Severin, R. Hokke, H. Wel, van der, G. With, de

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Abstract

The formation of the interface between electrolessly deposited Ni(P) and an alumina substrate was examd. Prior to metalization, the substrate was cleaned, etched, and activated with Sn, Ag, and Pd-contg. solns. Changes in surface chem. due to these pretreatments were analyzed with x-ray fluorescence and static SIMS. TEM plan-view micrographs visualized the changes in surface structure during the pretreatments. The initial stages of metalization were measured on Si3N4 membrane model substrates. Cross-section TEM micrographs were made of a thin Ni(P) film on the alumina ceramic, showing a columnar Ni(P) structure, a thin interfacial layer, and an intimate interfacial contact. Possible consequences for initiation and adhesion are discussed. [on SciFinder (R)]
Original languageEnglish
Pages (from-to)682-687
JournalJournal of the Electrochemical Society
Volume140
Issue number3
DOIs
Publication statusPublished - 1993

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